Chip-levelVacuum Package and Test of Resonant MEMS Electric Field Sensor

为了降低传感器的驱动电压，提高该器件的品质因数和信噪比，该文研究封装材料和工艺对真空封装性能的影响，针对一种微机电系统(MEMS)谐振式微型电场敏感结构芯片，采用独特的共晶键合技术，实现该传感器的芯片级真空封装。实验结果表明，该传感器封装后的品质因数达到了30727.4，是常压封装的500倍；该封装器件具有更低的驱动电压，只需要直流分量100 mV和交流分量60 mVp-p，与常压测试时相比，分别只有原来的1/200和1/16。In order to improve the Q (Quality factor) value and SNR (Signal to Noise Ratio) and reduce the driving voltage, chip-level vacuum package of Micro-Electro-Mechanical Systems (MEMS) based resonant miniature electric field sensor is realized. By way of a novel fusion bonding process with nanogetter added, the package cap is successfully bonded with the base substrate in very low pressure. The experimental results show that the Q-value of the sensor increases 500 times to 30727.4 and the driving voltage reduces to 100 mV +60 mVp-p which decreases to 1/200 and 1/16 respectively compared to air pressure.国家自然科学基金(61101049,61327810)资助课题EI中文核心期刊要目总览(PKU)中国科技核心期刊(ISTIC)中国科学引文数据库(CSCD)92282-22863