The sensitivity analysis of the back interface trap-induced recombination-generation (R-G) current of the lateral SOI forward gated-diode was given. The dependence of the R-G current sensitivity on the back interface traps was examined in the normalized form and the effects of some key factors such as the silicon film thickness and channel doping concentration were demonstrated. The results show the R-G current is heavily dependent on the interface trap density. The effects of the channel doping concentration and the silicon film thinckness of the SOI devices on the R-G current magnitude must be considered in order to accurately model the interface traps via the R-G current peak.EI0101292-12972
The forward gated-diode R-G current method has been used to monitor the F-N stressing-induced interf...
A numerical analysis of the charge-pumping experiment in thin-film SOI pin-diodes is presented. The ...
The forward gated-diode R-G current method was used to monitor the F-N stressing-induced interface t...
Characterized back interface traps of SOI devices by the Recombination-Generation (R-G) current has ...
The dependence of the Recombination-Generation (R-G) current on the bulk trap characteristics and si...
In this paper, main characteristics of the recombination-generation (R-G) current of the bulk traps ...
Application of the forward gated-diode recombination-generation (R-G) current method in extracting t...
Generation-recombination (g-r) parameters are of great importance for SOI devices, because they dete...
Generation-recombination (g-r) parameters are of great importance for SOI devices, because they dete...
Forward gated-diode recombination-generation (R-G) current method for characterizing the lateral lig...
A novel combined gated-diode technique for extracting the lateral distribution of interface traps in...
Based on the forward gated diode recombination current, a method for direct characterizing interface...
In this paper, the forward-biased gated-diode technique is proposed as a simple and reliable method ...
The generation of front and back gate interface and oxide traps due to a hot-carrier-stress in silic...
This peper describes the characterization of the hot carrier-induced interface traps by a forward ga...
The forward gated-diode R-G current method has been used to monitor the F-N stressing-induced interf...
A numerical analysis of the charge-pumping experiment in thin-film SOI pin-diodes is presented. The ...
The forward gated-diode R-G current method was used to monitor the F-N stressing-induced interface t...
Characterized back interface traps of SOI devices by the Recombination-Generation (R-G) current has ...
The dependence of the Recombination-Generation (R-G) current on the bulk trap characteristics and si...
In this paper, main characteristics of the recombination-generation (R-G) current of the bulk traps ...
Application of the forward gated-diode recombination-generation (R-G) current method in extracting t...
Generation-recombination (g-r) parameters are of great importance for SOI devices, because they dete...
Generation-recombination (g-r) parameters are of great importance for SOI devices, because they dete...
Forward gated-diode recombination-generation (R-G) current method for characterizing the lateral lig...
A novel combined gated-diode technique for extracting the lateral distribution of interface traps in...
Based on the forward gated diode recombination current, a method for direct characterizing interface...
In this paper, the forward-biased gated-diode technique is proposed as a simple and reliable method ...
The generation of front and back gate interface and oxide traps due to a hot-carrier-stress in silic...
This peper describes the characterization of the hot carrier-induced interface traps by a forward ga...
The forward gated-diode R-G current method has been used to monitor the F-N stressing-induced interf...
A numerical analysis of the charge-pumping experiment in thin-film SOI pin-diodes is presented. The ...
The forward gated-diode R-G current method was used to monitor the F-N stressing-induced interface t...