Wafer level Tungsten-Glass Bonding with Photosensitive BCB

Tungsten is a promising bulk material for microsystem applications for its high melting point, radiation resistance, high strength and conductivity. In this paper, wafer level Tungsten-Glass wafer bonding was carried out with photodefinable BCB, the results were compared with Si-Glass bonding. A high-yield BCB bonding technology was developed with good uniformity and relatively high bonding strength, which can be used in future device integration and micropackage.http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000319836000026&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=8e1609b174ce4e31116a60747a720701Engineering, Electrical & ElectronicEICPCI-S(ISTP)