Add to ORKGThe features of Cu6Sn5 growing slowly at lower temperature and growing up rapidly over 350??C, and/or Cu3Sn growing at higher temperatures, have been detailedly observed under SEM. The increase of Pb content seems to inhibit sequentially the growth of Cu6Sn5 in Pb-Sn alloy.EI0281-866
In situ observations of the reaction between solid Cu in contact with molten Sn–0.7 wt.% Cu were ach...
Transient liquid phase bonding under temperature gradient in electronics interconnections yields int...
A stereological analysis was carried out in order to obtain the kinetics parameters of the (Cu1-xNix...
The growth of Cu-Sn intermetallic compounds (IMCs) at the molten Pb-Sn solder/Cu interface was studi...
The tracer diffusion coefficients of the elements as well as the integrated interdiffusion coefficie...
International audienceThe formation of Cu3Sn phase in the soldering reaction is believed to be harmf...
The growth mechanisms of primary Cu6Sn5 are studied in Sn-Cu alloys and solder joints by combining E...
This paper presents the use of the transient liquid phase concept to grow the high temperature CuSni...
CuSn is the most common intermetallic compound (IMC) in lead-free solder joints, and is also a promi...
A strong influence of Ni content on the diffusion-controlled growth of the (Cu,Ni)(3)Sn and (Cu,Ni)(...
The solidestate growth of intermediate phases in the Cu-Sn and Ni-Sn systems is investigated in the ...
International audienceInterfacial reaction between solid e-Cu3Sn compound and liquid Sn at 250 °C is...
This paper investigates the effect of 0.05\ua0wt.% Ni on the formation and growth of primary CuSn in...
As the most common of the intermetallic compounds (IMCs) formed between Sn-based solders and Cu subs...
The formation and growth of Cu–Sn intermetallic film at the interface between molten Sn–Pb solders a...
In situ observations of the reaction between solid Cu in contact with molten Sn–0.7 wt.% Cu were ach...
Transient liquid phase bonding under temperature gradient in electronics interconnections yields int...
A stereological analysis was carried out in order to obtain the kinetics parameters of the (Cu1-xNix...
The growth of Cu-Sn intermetallic compounds (IMCs) at the molten Pb-Sn solder/Cu interface was studi...
The tracer diffusion coefficients of the elements as well as the integrated interdiffusion coefficie...
International audienceThe formation of Cu3Sn phase in the soldering reaction is believed to be harmf...
The growth mechanisms of primary Cu6Sn5 are studied in Sn-Cu alloys and solder joints by combining E...
This paper presents the use of the transient liquid phase concept to grow the high temperature CuSni...
CuSn is the most common intermetallic compound (IMC) in lead-free solder joints, and is also a promi...
A strong influence of Ni content on the diffusion-controlled growth of the (Cu,Ni)(3)Sn and (Cu,Ni)(...
The solidestate growth of intermediate phases in the Cu-Sn and Ni-Sn systems is investigated in the ...
International audienceInterfacial reaction between solid e-Cu3Sn compound and liquid Sn at 250 °C is...
This paper investigates the effect of 0.05\ua0wt.% Ni on the formation and growth of primary CuSn in...
As the most common of the intermetallic compounds (IMCs) formed between Sn-based solders and Cu subs...
The formation and growth of Cu–Sn intermetallic film at the interface between molten Sn–Pb solders a...
In situ observations of the reaction between solid Cu in contact with molten Sn–0.7 wt.% Cu were ach...
Transient liquid phase bonding under temperature gradient in electronics interconnections yields int...
A stereological analysis was carried out in order to obtain the kinetics parameters of the (Cu1-xNix...