Characteristic variation of FinFET due to Fin vertical nonuniformity is simulated in this paper, based on the compact device model. This vertical nonuniformity is generated during the real etching process and induces Fin thickness variation along the height direction. Therefore, the characteristics, such as threshold voltage, sub-threshold slope, on state current, off state current and total channel resistor are investigated influenced by Fin height and deviation angle. The impact of the deviation angle on both digital and analog circuit performance is also predicted.EI
This paper investigates the effect of process variations on unity gain frequency (ft) in 30 nm gate ...
This paper investigates the effect of process variations on unity gain frequency (ft) in 30 nm gate ...
The impact of process induced variation on the response of SOI FinFET to heavy ion irradiation is st...
The effects of nonrectangular fin cross section of double-gate FinFETs are studied. For a given top-...
The impact of non-vertical sidewall on sub-50nm FinFET is studied. The FinFET process transfers the ...
The trapezium is often a better approximation for the FinFET cross-section shape, rather than the de...
Fin field effect transistors (FinFETS) are silicon-on-insulator (SOI) transistors with three-dimensi...
To conduct analyses of variability of threshold voltage (Vth) in FinFETs whose structures are based ...
This paper studies the impact of fin width of channel on temperature and electrical characteristics ...
A compact model to correlate FinFET device variability to the spatial fluctuation of fin-width is de...
Extensive numerical simulations of FinFET structures have been carried out using commercial TCAD too...
A compact model is developed to study the fin-width roughness (FWR) induced device variability and i...
We examined the effects of device parameters on the transfer characteristics of triple-gate fin fiel...
The impact of fin-thickness nonuniformities on carrier transport in FinFETs is analyzed with a quasi...
The impact of the fin thickness and the gate oxide thickness on the electrical characteristics of Fi...
This paper investigates the effect of process variations on unity gain frequency (ft) in 30 nm gate ...
This paper investigates the effect of process variations on unity gain frequency (ft) in 30 nm gate ...
The impact of process induced variation on the response of SOI FinFET to heavy ion irradiation is st...
The effects of nonrectangular fin cross section of double-gate FinFETs are studied. For a given top-...
The impact of non-vertical sidewall on sub-50nm FinFET is studied. The FinFET process transfers the ...
The trapezium is often a better approximation for the FinFET cross-section shape, rather than the de...
Fin field effect transistors (FinFETS) are silicon-on-insulator (SOI) transistors with three-dimensi...
To conduct analyses of variability of threshold voltage (Vth) in FinFETs whose structures are based ...
This paper studies the impact of fin width of channel on temperature and electrical characteristics ...
A compact model to correlate FinFET device variability to the spatial fluctuation of fin-width is de...
Extensive numerical simulations of FinFET structures have been carried out using commercial TCAD too...
A compact model is developed to study the fin-width roughness (FWR) induced device variability and i...
We examined the effects of device parameters on the transfer characteristics of triple-gate fin fiel...
The impact of fin-thickness nonuniformities on carrier transport in FinFETs is analyzed with a quasi...
The impact of the fin thickness and the gate oxide thickness on the electrical characteristics of Fi...
This paper investigates the effect of process variations on unity gain frequency (ft) in 30 nm gate ...
This paper investigates the effect of process variations on unity gain frequency (ft) in 30 nm gate ...
The impact of process induced variation on the response of SOI FinFET to heavy ion irradiation is st...