A reliability test device for measuring the torsional strength of anchors in micro electro-mechanical system (MEMS) devices was designed and fabricated by silicon-on-glass (SOG) process. The device consists of cantilever beam, array-shaped anchor and measuring scale. Torsional fracture tests were carried out on these devices with various anchor sizes. Utilizing the test results, the correlation between torsional strength and side length of anchor was obtained by the finite element analysis (FEA). The fracture morphology also revealed that the bonding strength of array-shaped anchor is much stronger than the ultimate strength of silicon and glass. ? 2013 IEEE.EI
Designing reliable MEMS structures presents numerous challenges. Polycrystalline silicon fractures i...
This paper focuses on micro and nano bonding technology and bonding strength. The micro electro mech...
A new way to evaluate the strength of micro-scale bonding is developed by using a silicon cantilever...
Two series of devices, bonding quality testing devices and torsional strength testing devices, were ...
To investigate the mechanical strength of the anchor-microbeam combined structure, two series of dev...
To investigate the mechanical strength of the anchor-microbeam combined structure, two series of dev...
In this paper, an array-shaped anchor for microdevice (fabricated by silicon-on-glass (SOG) process)...
This paper presents a test structure, designed for measuring the shear strength of anchors in MEMS d...
This paper discusses the fracture strength study of torsion springs in MEMS microscanners, which are...
An in-plane load measuring technique is developed to perform the strength test of the micro-cantilev...
The tensile strength of a silicon nanowire (SiNW) that had been integrated into a silicon-on-insulat...
The tensile strength of a silicon nanowire (SiNW) that had been integrated into a silicon-on-insulat...
In this paper, theoretical fracture mechanics concepts as well as strength and fatigue testing metho...
We have designed, fabricated, tested and modeled a first generation small area test structure for ME...
Mission critical applications of MEMS devices require knowledge of the distribution in their materia...
Designing reliable MEMS structures presents numerous challenges. Polycrystalline silicon fractures i...
This paper focuses on micro and nano bonding technology and bonding strength. The micro electro mech...
A new way to evaluate the strength of micro-scale bonding is developed by using a silicon cantilever...
Two series of devices, bonding quality testing devices and torsional strength testing devices, were ...
To investigate the mechanical strength of the anchor-microbeam combined structure, two series of dev...
To investigate the mechanical strength of the anchor-microbeam combined structure, two series of dev...
In this paper, an array-shaped anchor for microdevice (fabricated by silicon-on-glass (SOG) process)...
This paper presents a test structure, designed for measuring the shear strength of anchors in MEMS d...
This paper discusses the fracture strength study of torsion springs in MEMS microscanners, which are...
An in-plane load measuring technique is developed to perform the strength test of the micro-cantilev...
The tensile strength of a silicon nanowire (SiNW) that had been integrated into a silicon-on-insulat...
The tensile strength of a silicon nanowire (SiNW) that had been integrated into a silicon-on-insulat...
In this paper, theoretical fracture mechanics concepts as well as strength and fatigue testing metho...
We have designed, fabricated, tested and modeled a first generation small area test structure for ME...
Mission critical applications of MEMS devices require knowledge of the distribution in their materia...
Designing reliable MEMS structures presents numerous challenges. Polycrystalline silicon fractures i...
This paper focuses on micro and nano bonding technology and bonding strength. The micro electro mech...
A new way to evaluate the strength of micro-scale bonding is developed by using a silicon cantilever...