Add to ORKGWe have developed an optimized model for electron behavior in Cu-line and we have implemented it using Monte Carlo method. Our model takes into account not only four normal scatterings but also the grain boundary scattering and the surface roughness scattering. The model has been tested with different line width and providing a good agreement with both calculated results and ITRS data.Engineering, Electrical & ElectronicPhysics, AppliedCPCI-S(ISTP)
A two-dimensional cross-sectional poly-lattice kinetic Monte Carlo (2DCSP-KMC) model has been develo...
An analogue Monte-Carlo code has been used to simulate the transport of positrons in copper with an ...
this paper, values of the parameters associated with the various steps in the overall reaction mecha...
We have developed an optimized model for electron behavior in Cu-Iine and we have implemented it usi...
The size effect of copper interconnect in nanoscale based on various scattering mechanisms including...
The copper interconnect comes into nanometers with the scaling down of device dimension. At the same...
The resistivity of Cu interconnects increases rapidly with continuously scaling down due to scatteri...
This work addresses the resistivity increase in Cu interconnects with decreasing line width. Recent ...
This work addresses the classical size effect in interconnect metals and presents the theoretical ba...
The improvements in the density of integrated circuits and device performance have been achieved thr...
The work addresses the resistivity increase in Cu interconnects with decreasing linewidth. The surfa...
A simple geometry is used to compare several of the available Monte Carlo software codes for radiati...
Monte Carlo (MC) technique allows solving mathematical and physical problems of great complexity. On...
Monte Carlo simulations are very useful for many physical processes. The transport of particles was ...
We report a quantitative analysis of surface and grain boundary scattering in encapsulated Cu thin f...
A two-dimensional cross-sectional poly-lattice kinetic Monte Carlo (2DCSP-KMC) model has been develo...
An analogue Monte-Carlo code has been used to simulate the transport of positrons in copper with an ...
this paper, values of the parameters associated with the various steps in the overall reaction mecha...
We have developed an optimized model for electron behavior in Cu-Iine and we have implemented it usi...
The size effect of copper interconnect in nanoscale based on various scattering mechanisms including...
The copper interconnect comes into nanometers with the scaling down of device dimension. At the same...
The resistivity of Cu interconnects increases rapidly with continuously scaling down due to scatteri...
This work addresses the resistivity increase in Cu interconnects with decreasing line width. Recent ...
This work addresses the classical size effect in interconnect metals and presents the theoretical ba...
The improvements in the density of integrated circuits and device performance have been achieved thr...
The work addresses the resistivity increase in Cu interconnects with decreasing linewidth. The surfa...
A simple geometry is used to compare several of the available Monte Carlo software codes for radiati...
Monte Carlo (MC) technique allows solving mathematical and physical problems of great complexity. On...
Monte Carlo simulations are very useful for many physical processes. The transport of particles was ...
We report a quantitative analysis of surface and grain boundary scattering in encapsulated Cu thin f...
A two-dimensional cross-sectional poly-lattice kinetic Monte Carlo (2DCSP-KMC) model has been develo...
An analogue Monte-Carlo code has been used to simulate the transport of positrons in copper with an ...
this paper, values of the parameters associated with the various steps in the overall reaction mecha...