High-temperature and high-pressure connection between micro combustor and macro world for feeding of air/fuel gas is required in PowerMEMS development. A Kovar tubing-Glass-Si sealing process has been developed for an on-going PowerMEMS project to connect Kovar tubes with diameters of 2mm and 4mm, to top Si wafer of micro combustor fabricated by DRIE process. Due to the different CTEs (coefficients of thermal expansion) of the connected materials, thermal stress around the sealing area could probably influence the obturation and other properties of the sealed combustor. A numeric simulation on sealing of the structure was conducted on ANSYS software to investigate this kind of sealing process. The thermal stress and displacement from room t...
This article addresses the reactive thermal processing of locally heated intermetallic seals for mic...
ABSTRACT This paper presents the development of microfabricated "on-chip" polysilicon igni...
In this paper, a high performance wafer-level vacuum packaging technology based on GSG triple-layer ...
High-temperature and high-pressure connection between micro combustor and macro world for feeding of...
The fluidic packaging of Power MEMS devices such as the MIT microengine and microrocket requires the...
Localized heating and bonding techniques have been developed for hermetic and vacuum packaging of ME...
The characteristics and mechanisms of damage and failure in microfluidic joints consisting of Kovar ...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Aeronautics and Astronautics, 2000.Al...
As fluidic microelectromechanical devices are developing and often attached to, or embedded in, larg...
Silicon-glass anodic bonding, commonly used for MEMS packaging, offers many advantages. However, out...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2011.Cataloge...
The aim of this investigation was to establish a methodology for designing highly stressed micro fab...
Local anodic bonding of a common Kovar alloy to Pyrex is presented. This technique is ideally suitab...
As part of an effort to develop MEMS-based power generation system, an assembly solution for combust...
Resistance heating of the gasket strip in a gem-anvil high pressure cell was successful in obtaining...
This article addresses the reactive thermal processing of locally heated intermetallic seals for mic...
ABSTRACT This paper presents the development of microfabricated "on-chip" polysilicon igni...
In this paper, a high performance wafer-level vacuum packaging technology based on GSG triple-layer ...
High-temperature and high-pressure connection between micro combustor and macro world for feeding of...
The fluidic packaging of Power MEMS devices such as the MIT microengine and microrocket requires the...
Localized heating and bonding techniques have been developed for hermetic and vacuum packaging of ME...
The characteristics and mechanisms of damage and failure in microfluidic joints consisting of Kovar ...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Aeronautics and Astronautics, 2000.Al...
As fluidic microelectromechanical devices are developing and often attached to, or embedded in, larg...
Silicon-glass anodic bonding, commonly used for MEMS packaging, offers many advantages. However, out...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2011.Cataloge...
The aim of this investigation was to establish a methodology for designing highly stressed micro fab...
Local anodic bonding of a common Kovar alloy to Pyrex is presented. This technique is ideally suitab...
As part of an effort to develop MEMS-based power generation system, an assembly solution for combust...
Resistance heating of the gasket strip in a gem-anvil high pressure cell was successful in obtaining...
This article addresses the reactive thermal processing of locally heated intermetallic seals for mic...
ABSTRACT This paper presents the development of microfabricated "on-chip" polysilicon igni...
In this paper, a high performance wafer-level vacuum packaging technology based on GSG triple-layer ...