Add to ORKGA novel radio-frequency inductor with single-crystal-silicon spiral structure suspended on glass substrate is reported. The inductor is fabricated by using an improved silicon-glass anodic bonding and deep etching releasing process combined with electroless copper plating technology. The newly developed process is proved simple, stable and easily controlled. Based on the process, the performances of the inductor, such as quality factor, inductance and operating frequency, can be adjusted by changing the structure parameters. Through the electroless copper plating, the silicon spiral structure of the inductor is encapsulated completely by highly conformal copper film. Furthermore, a thin nickel film is plated on the top of the copper layer f...
In this paper, high Q copper inductors were fabricated by the electroplating process on low-cost and...
This paper presents the design and fabrication of integrated micromachined inductors on silicon subs...
This paper reports a new fabrication process that can be used to integrate high-power-density and lo...
A high-performance RF MEMS inductor is fabricated using an improved silicon-glass anodic-bonding and...
A novel MEMS inductor consisting of a planar single crystalline silicon spiral with a copper surface...
An electroless copper plating process has been developed for bulk-silicon micromachined radio freque...
This letter presents a novel radio frequency (RF) inductor in a monolithic inductor-capacitor circui...
An on-chip suspended high electromagnetically shielded spiral inductor was fabricated using silicon ...
[[abstract]]A silicon micromachining method has been developed to fabricate on-chip high-performance...
Polysilicon spiral inductors encapsulated with copper (Cu) were suspended over 30-μm-deep cavities i...
A successful design of a radio frequency inductor based on a silicon microelectromechanical system f...
A successful design of RF inductor based on a silicon MEMS foundry process is presented. The suspend...
This paper reports on an inductor fabrication method capable to deliver high quality factor (Q) devi...
We present copper structures composed of multilayer, stacked inductors (MLSIs) with tens of micro-He...
This paper reports on an inductor fabrication method capable to deliver high quality factor (Q) and ...
In this paper, high Q copper inductors were fabricated by the electroplating process on low-cost and...
This paper presents the design and fabrication of integrated micromachined inductors on silicon subs...
This paper reports a new fabrication process that can be used to integrate high-power-density and lo...
A high-performance RF MEMS inductor is fabricated using an improved silicon-glass anodic-bonding and...
A novel MEMS inductor consisting of a planar single crystalline silicon spiral with a copper surface...
An electroless copper plating process has been developed for bulk-silicon micromachined radio freque...
This letter presents a novel radio frequency (RF) inductor in a monolithic inductor-capacitor circui...
An on-chip suspended high electromagnetically shielded spiral inductor was fabricated using silicon ...
[[abstract]]A silicon micromachining method has been developed to fabricate on-chip high-performance...
Polysilicon spiral inductors encapsulated with copper (Cu) were suspended over 30-μm-deep cavities i...
A successful design of a radio frequency inductor based on a silicon microelectromechanical system f...
A successful design of RF inductor based on a silicon MEMS foundry process is presented. The suspend...
This paper reports on an inductor fabrication method capable to deliver high quality factor (Q) devi...
We present copper structures composed of multilayer, stacked inductors (MLSIs) with tens of micro-He...
This paper reports on an inductor fabrication method capable to deliver high quality factor (Q) and ...
In this paper, high Q copper inductors were fabricated by the electroplating process on low-cost and...
This paper presents the design and fabrication of integrated micromachined inductors on silicon subs...
This paper reports a new fabrication process that can be used to integrate high-power-density and lo...