3D mixed-mode device-circuit simulation is presented to investigate the impact of line edge roughness (LER) on the stability of a FinFET SRAM. In this work, LER sequence is statistically generated by a Fourier analysis of the power spectrum of Gaussian autocorrelation function. The sensitivity of 20 nm FinFET SRAM of Read and Write static noise margins (SNM) to fin LER is evaluated. The results show that FinFET SRAM is more tolerant of disturbance in write operation than in read disturbance. The dependence of Read SNM on fin LER's root mean square (RMS) amplitude, fin thickness and supply voltage is also analyzed. Furthermore, methods to reduce the LER effect on the FinFET SRAM's read stability are introduced. Optimization of the ...
Abstract — In this paper, we develop an evaluation framework to assess variability in nanoscale inve...
Three-dimensional (3D) statistical simulation is presented to propose using triple-gate (TG) fin fie...
Intra-die fluctuations in the nanoscale CMOS technology emerge inherently to geometrical variations ...
3-D mixed-mode device-circuit simulation is presented to investigate stochastic mismatch of FinFETs ...
Replacing the conventional MOSFET architecture with multiple gate structures like the FinFET can imp...
none3noWhile traditional scaling used to be accompanied by an improvement in device performance, thi...
As a result of CMOS scaling, the critical dimension (CD) of integrated circuits has been shrinking. ...
FinFET is a promising architecture for low voltage/low-power applications at and beyond the 32nm tec...
Threshold voltage ðVT Þ and drive current ðIONÞ variability of low stand-by power (LSTP)-32 nm FinFE...
The impact of fin line-edge roughness on threshold voltage and drive current of LSTP-32nm Fin-FETs i...
This paper developed a full three-dimensional (3-D) statistical simulation approach to investigate F...
FinFETs may start to replace planar MOSFETs for specific applications at the 32nm node and beyond du...
The impact of line-edge roughness (LER) on double-gate (DG) Schottky-barrier field-effect transistor...
We explore the 6T and 8T SRAM design spaces through read static noise margin (RSNM), word-line write...
As the transistors are scaled down, undesirable performance mismatch in identically designed transis...
Abstract — In this paper, we develop an evaluation framework to assess variability in nanoscale inve...
Three-dimensional (3D) statistical simulation is presented to propose using triple-gate (TG) fin fie...
Intra-die fluctuations in the nanoscale CMOS technology emerge inherently to geometrical variations ...
3-D mixed-mode device-circuit simulation is presented to investigate stochastic mismatch of FinFETs ...
Replacing the conventional MOSFET architecture with multiple gate structures like the FinFET can imp...
none3noWhile traditional scaling used to be accompanied by an improvement in device performance, thi...
As a result of CMOS scaling, the critical dimension (CD) of integrated circuits has been shrinking. ...
FinFET is a promising architecture for low voltage/low-power applications at and beyond the 32nm tec...
Threshold voltage ðVT Þ and drive current ðIONÞ variability of low stand-by power (LSTP)-32 nm FinFE...
The impact of fin line-edge roughness on threshold voltage and drive current of LSTP-32nm Fin-FETs i...
This paper developed a full three-dimensional (3-D) statistical simulation approach to investigate F...
FinFETs may start to replace planar MOSFETs for specific applications at the 32nm node and beyond du...
The impact of line-edge roughness (LER) on double-gate (DG) Schottky-barrier field-effect transistor...
We explore the 6T and 8T SRAM design spaces through read static noise margin (RSNM), word-line write...
As the transistors are scaled down, undesirable performance mismatch in identically designed transis...
Abstract — In this paper, we develop an evaluation framework to assess variability in nanoscale inve...
Three-dimensional (3D) statistical simulation is presented to propose using triple-gate (TG) fin fie...
Intra-die fluctuations in the nanoscale CMOS technology emerge inherently to geometrical variations ...