The impact of junction formed by the electrode and bulk in phase change memory to conduction at the amorphous high resistance state is studied in this paper. Analytical model deduced from basic physical equation elucidates that the current changes from junction barrier limited to bulk barrier limited when the applied voltage increases. The currents deduced from the model are in highly consistent with the measurement data at different temperatures. It is also found that the junction barrier becomes non-negligible when the radius of bottom electrode is scaled down to 20 nm. ? 2014 IEEE.EI
International audienceA Phase-Change Memory (PCM) compact modeling of the threshold switching based ...
International audienceIn this paper we analyze recent progress in Phase-Change Memory (PCM) technolo...
Discontinuity of electrical and thermal conductivity values at melt has been reported in phase chang...
Chalcogenide materials are receiving increasing interest for their many applications as active mate...
Advancements in integrated circuits demand an increasing requirement for\ud a faster, low-cost non-v...
The uniformity of threshold voltage and threshold current in the In2Se3 nanowire-based phase change ...
Chalcogenide materials are receiving increasing interest for their many applications as active mate...
The electronic behavior of the chalcogenide material used in phase-change memory (PCM) plays a key r...
WOS:000355925600029The high contrast in the electrical resistivity between amorphous and crystalline...
With respect to the operation of a Phase-change Random Access Memory (PRAM or PcRAM), we studied the...
Phase change materials, typically composed out of Ge, Sb and Te alloys, are materials that can switc...
Temporal drift of the amorphous resistance in phase-change random access memory (PRAM) is a temperat...
International audienceA Phase-Change Memory (PCM) physical-based compact modeling of the subthreshol...
I simulate phase change including stochastic nucleation and growth of discrete grains with a finite ...
The forming process is a necessary and irreversible process to activate the resistance switching beh...
International audienceA Phase-Change Memory (PCM) compact modeling of the threshold switching based ...
International audienceIn this paper we analyze recent progress in Phase-Change Memory (PCM) technolo...
Discontinuity of electrical and thermal conductivity values at melt has been reported in phase chang...
Chalcogenide materials are receiving increasing interest for their many applications as active mate...
Advancements in integrated circuits demand an increasing requirement for\ud a faster, low-cost non-v...
The uniformity of threshold voltage and threshold current in the In2Se3 nanowire-based phase change ...
Chalcogenide materials are receiving increasing interest for their many applications as active mate...
The electronic behavior of the chalcogenide material used in phase-change memory (PCM) plays a key r...
WOS:000355925600029The high contrast in the electrical resistivity between amorphous and crystalline...
With respect to the operation of a Phase-change Random Access Memory (PRAM or PcRAM), we studied the...
Phase change materials, typically composed out of Ge, Sb and Te alloys, are materials that can switc...
Temporal drift of the amorphous resistance in phase-change random access memory (PRAM) is a temperat...
International audienceA Phase-Change Memory (PCM) physical-based compact modeling of the subthreshol...
I simulate phase change including stochastic nucleation and growth of discrete grains with a finite ...
The forming process is a necessary and irreversible process to activate the resistance switching beh...
International audienceA Phase-Change Memory (PCM) compact modeling of the threshold switching based ...
International audienceIn this paper we analyze recent progress in Phase-Change Memory (PCM) technolo...
Discontinuity of electrical and thermal conductivity values at melt has been reported in phase chang...