Board Level Assembly of Inertial MEMS Devices Based on Surface Mounting Technology

In this paper, the board level assembly of inertial MEMS devices using Surface Mounting Technology (SMT) in mass production has been studied. MEMS microphone is taken as a representative device. Meanwhile, assembly precision and strength are also analyzed in the experiments. A further analyze in assembly strength has been done using theoretical simulation. The result indicates the full compatibility of MEMS devices with SMT. Design principles of the application of inertial MEMS devices in SMT has also been discussed.http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000260248800108&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=8e1609b174ce4e31116a60747a720701Engineering, Electrical & ElectronicEngineering, MechanicalEICPCI-S(ISTP)