A unified FinFET reliability model including high K stack dynamic threshold (HKSDT), hot carrier injection (HCI), and negative bias temperature instability (NBTI) has been developed and verified by experimental data. The FinFET based circuit performances are simulated and compared under these reliability issues by HSPICE simulator after the inclusion of the presented model.Automation & Control SystemsEngineering, Electrical & ElectronicNanoscience & NanotechnologyEICPCI-S(ISTP)
International audienceThe hot-carrier (HC) degradation of short-channel n-FinFETs is investigated. T...
A detail analysis for nanoscale FinFET performance degradation induced by the Hot Carrier Injection ...
Hot carrier injection (HCI) can generate interface traps or oxide traps mainly by dissociating the S...
A unified FinFET reliability model including high K stack dynamic threshold (HKSDT), hot carrier inj...
Positive Bias Temperature Instability (PBTI) of HfO2/metal gate n-channel bulk FinFET is simulated t...
A physical based model for predicting the performance degradation of the FinFET is developed account...
A physical based model for predicting the performance degradation of the FinFET is developed account...
The continuous downscaling of CMOS technologies over the last few decades resulted in higher Integra...
The development of CMOS technology is a double-edged sword: for one thing, it provides faster,lowerp...
Reliability of FinFETs is studied in this paper using the forward gated-diode generation-recombinati...
When scaling down of transistors reaches below 20nm, the reliability of a device becomes more import...
In this paper, we report a study to understand the fin width dependence on performance, variability ...
session posterInternational audienceFigure 1(a) shows the degradation of the transfer characteristic...
The introduction of High-κ Metal Gate transistors led to higher integration density, low leakage cur...
forward gated-diode generation-recombination (G-R) current. It is observed that the stress induced i...
International audienceThe hot-carrier (HC) degradation of short-channel n-FinFETs is investigated. T...
A detail analysis for nanoscale FinFET performance degradation induced by the Hot Carrier Injection ...
Hot carrier injection (HCI) can generate interface traps or oxide traps mainly by dissociating the S...
A unified FinFET reliability model including high K stack dynamic threshold (HKSDT), hot carrier inj...
Positive Bias Temperature Instability (PBTI) of HfO2/metal gate n-channel bulk FinFET is simulated t...
A physical based model for predicting the performance degradation of the FinFET is developed account...
A physical based model for predicting the performance degradation of the FinFET is developed account...
The continuous downscaling of CMOS technologies over the last few decades resulted in higher Integra...
The development of CMOS technology is a double-edged sword: for one thing, it provides faster,lowerp...
Reliability of FinFETs is studied in this paper using the forward gated-diode generation-recombinati...
When scaling down of transistors reaches below 20nm, the reliability of a device becomes more import...
In this paper, we report a study to understand the fin width dependence on performance, variability ...
session posterInternational audienceFigure 1(a) shows the degradation of the transfer characteristic...
The introduction of High-κ Metal Gate transistors led to higher integration density, low leakage cur...
forward gated-diode generation-recombination (G-R) current. It is observed that the stress induced i...
International audienceThe hot-carrier (HC) degradation of short-channel n-FinFETs is investigated. T...
A detail analysis for nanoscale FinFET performance degradation induced by the Hot Carrier Injection ...
Hot carrier injection (HCI) can generate interface traps or oxide traps mainly by dissociating the S...