The effects of focused-ion-beam-induced damage on electrical properties of n-type Si are investigated by Schottky contacts. Crystalline Si is exposed to 10-30 keV focused ion beam (FIB), followed by Pt deposition under vacuum of 4x10(-4) Pa. From current-voltage-temperature measurements, barrier heights of the Schottky contacts are found to increase almost linearly as the FIB energy increases, with the maximum increment of 0.29 eV. The increase is suggested to be related to the arising of acceptorlike defects and an amorphous layer due to FIB damages. A theoretical model is set up to quantitatively describe the barrier height changes. (c) 2006 American Institute of Physics.Physics, AppliedSCI(E)EI0ARTICLE15null8
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The effects of irradiation from a focused ion beam (FIB) system on MOS transistors are reported syst...
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Damage in Si induced by irradiation with various light/medium mass ions at elevated temperatures and...
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The accumulation of damage and the development of mechanical strain in crystalline Si (c-Si) by O an...
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Argon ion bombardment changes completely the nature of metal-Si contacts : the metal-Si(n) contact b...
Silicon is still one of the most used materials for fabrication of solar cells. Some imperfections a...
We have studied damage of crystalline Si surfaces induced by electronic energy loss of swift heavy i...
The lateral damage induced by focused ion beam on silicon carbide was characterized using electrical...
The study of defects in semiconductors has been on-going for over 50 years. During this time, resear...
In this paper, we report on defects introduced in epitaxially grown n-type silicon (Si) during elect...
In situ current-voltage ( I - V ) analyses of Pt/n-Si (100) Schottky barrier (SB) diode are carried ...
Mo/Si contacts to n-GaAs are fabricated by deposition of three alternate layers of Mo and Si using e...
Des diodes Schottky ont été réalisées sur du silicium de type N dont la surface a subi un recuit par...
The effects of irradiation from a focused ion beam (FIB) system on MOS transistors are reported syst...
Transmission electron microscopy (TEM) is a standard technique to characterize microelectronic devic...
Damage in Si induced by irradiation with various light/medium mass ions at elevated temperatures and...
Degradation of n-Si/PtSi/(Ti-W)/Al Schottky contacts was observed for thermal treatments at 500–550°...
The accumulation of damage and the development of mechanical strain in crystalline Si (c-Si) by O an...
The electrical properties of implanted p+ layers, shallow p+-n junctions, and a quasi-one-dimensiona...
Argon ion bombardment changes completely the nature of metal-Si contacts : the metal-Si(n) contact b...
Silicon is still one of the most used materials for fabrication of solar cells. Some imperfections a...
We have studied damage of crystalline Si surfaces induced by electronic energy loss of swift heavy i...