A New Isolation Technology for Automotive Power-Integrated-Circuit Applications
- Sun, Jingmeng
- Jiang, Frank X. C.
- Guan, Lingpeng
- Xiong, Zhibin
- Yan, Guizhen
- Sin, Johnny K. O.
DOIAbstract
In this paper, a new bulk silicon isolation structure with wafer-thick trenches is proposed for automotive (42 V) power-integrated-circuit applications. This technology provides the advantages of complete isolation with lower wafer cost and higher thermal-dissipation capability as compared with the silicon-on-insulator technology. Experimental results show that the new isolation structure can provide complete electrical isolation and with a 13% reduction in thermal resistance.Engineering, Electrical & ElectronicPhysics, AppliedSCI(E)EI1ARTICLE92144-21495
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