研究了在软击穿后MOS晶体管特性的退化.在晶体管上加均匀的电压应力直到软击穿发生的过程中监控晶体管的参数.在软击穿后,输出特性和转移特性只有小的改变.在软击穿发生时,漏端的电流和域值电压的退化是连续变化的.但是,在软击穿时栅漏电流突然有大量的增加.对软击穿后的栅漏电流增量的分析表明,软击穿后的电流机制是FN隧穿,这是软击穿引起的氧化物的势垒高度降低造成的.The degradation of MOS transistor operation due to soft breakdown of the gate oxide is studied.Important transistor parameters are monitored under homogeneous stress at different temperature until the soft breakdown occurred.The output and transfer characteristic have small change after soft breakdown as the degradations of drain current and threshold voltage is continuous.However,the increment of gate leakage current increases abruptly after the soft breakdown.The analysis to the increment of gate leakage current after the soft breakdown shows mechanism of similar...
The conduction mechanism of ultra-thin gate oxide n-metal-oxide-semiconductor field effect transisto...
In this work, the characteristics of the substrate current (I sub) to soft breakdowns (SBDs) in n-MO...
A detail experimental study on the reliability degradation of pMOSFET under non-uniform NBTI stress ...
研究了在恒压应力下超薄栅nMOSFET软击穿后的衬底电流特性.软击穿时间由衬底电流随时间的弛豫特性和器件输出特性测量时监测的衬底电流突变确定.发现软击穿时间的威布尔斜率和衬底特征击穿电流随温度的升高而...
The characteristics of the substrate current (Isub) after soft breakdown (SBD) in ultra-thin gate ox...
研究了高K(高介电常数)栅介质HfO2薄膜的制备工艺,制备了有效氧化层厚度为2.9 nm的超薄MOS电容.当栅氧化层很薄时会发生软击穿现象,软击穿和通常的硬击穿是不同的现象.分别利用在栅介质上加恒流应...
利用电子速度饱和概念和比例差值方法(proportional difference operator,PDO)研究了超薄SiO2在第一次软击穿以后栅电流随着栅电压的变化所呈现的饱和性质.实验证明了第一...
90 p.The purpose of this project is to study the gate oxide breakdown in ultra-thin pMOSFETs using c...
We have investigated the properties of soft breakdown (SBD) in thin oxide (4.5 nm) nMOSFETs with mea...
研究了热载流子应力下栅厚为2.1nm,栅长为0.135μm的pMOSFET中HALO掺杂剂量与器件的退化机制和参数退化的关系.实验发现,器件的退化机制对HALO掺杂剂量的改变不敏感,但是器件的线性漏电...
Abstract—We have investigated the properties of soft break-down (SBD) in thin oxide (4.5 nm) nMOSFET...
研究了低栅电压范围的热载流子统一退化模型.发现对于厚氧化层的p-MOSFETs主要退化机制随应力电压变化而变化,随着栅电压降低,退化机制由氧化层俘获向界面态产生转变,而薄氧化层没有这种情况,始终是界面...
The degradation of MOSFETs under high field stress has been investigated for a long time. The degrad...
La progressivité du claquage des oxydes de grille d'épaisseurs inférieures à 20 nm permet d'envisage...
120 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2001.For ultrathin oxides, a new t...
The conduction mechanism of ultra-thin gate oxide n-metal-oxide-semiconductor field effect transisto...
In this work, the characteristics of the substrate current (I sub) to soft breakdowns (SBDs) in n-MO...
A detail experimental study on the reliability degradation of pMOSFET under non-uniform NBTI stress ...
研究了在恒压应力下超薄栅nMOSFET软击穿后的衬底电流特性.软击穿时间由衬底电流随时间的弛豫特性和器件输出特性测量时监测的衬底电流突变确定.发现软击穿时间的威布尔斜率和衬底特征击穿电流随温度的升高而...
The characteristics of the substrate current (Isub) after soft breakdown (SBD) in ultra-thin gate ox...
研究了高K(高介电常数)栅介质HfO2薄膜的制备工艺,制备了有效氧化层厚度为2.9 nm的超薄MOS电容.当栅氧化层很薄时会发生软击穿现象,软击穿和通常的硬击穿是不同的现象.分别利用在栅介质上加恒流应...
利用电子速度饱和概念和比例差值方法(proportional difference operator,PDO)研究了超薄SiO2在第一次软击穿以后栅电流随着栅电压的变化所呈现的饱和性质.实验证明了第一...
90 p.The purpose of this project is to study the gate oxide breakdown in ultra-thin pMOSFETs using c...
We have investigated the properties of soft breakdown (SBD) in thin oxide (4.5 nm) nMOSFETs with mea...
研究了热载流子应力下栅厚为2.1nm,栅长为0.135μm的pMOSFET中HALO掺杂剂量与器件的退化机制和参数退化的关系.实验发现,器件的退化机制对HALO掺杂剂量的改变不敏感,但是器件的线性漏电...
Abstract—We have investigated the properties of soft break-down (SBD) in thin oxide (4.5 nm) nMOSFET...
研究了低栅电压范围的热载流子统一退化模型.发现对于厚氧化层的p-MOSFETs主要退化机制随应力电压变化而变化,随着栅电压降低,退化机制由氧化层俘获向界面态产生转变,而薄氧化层没有这种情况,始终是界面...
The degradation of MOSFETs under high field stress has been investigated for a long time. The degrad...
La progressivité du claquage des oxydes de grille d'épaisseurs inférieures à 20 nm permet d'envisage...
120 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2001.For ultrathin oxides, a new t...
The conduction mechanism of ultra-thin gate oxide n-metal-oxide-semiconductor field effect transisto...
In this work, the characteristics of the substrate current (I sub) to soft breakdowns (SBDs) in n-MO...
A detail experimental study on the reliability degradation of pMOSFET under non-uniform NBTI stress ...