We have investigated the roles of interfacial reaction, work function variation, and localized states of annealed Ti/Al ohmic contacts to p-type 4H-SiC. The Al was found to be absent in the near interface region. The possibility of additional p-doping by Al indiffusion in the top SiC layer was ruled out. The work function of Ti3SiC2, the direct contact layer to SiC, was determined to be intermediate between Ti and p-SiC, leading to a considerably lowered Schottky barrier height. Reaction-induced interfacial states were observed in the near-interface SiC, which may further reduce the barrier height and cause the formation of ohmic contact.http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&Ke...
This study deals with the interfacial reactions and electrical properties of Ta/4H-SiCcontacts. Tant...
SiC is a promising wide bandgap semiconductor material for active electronic devices. An important p...
The fabrication of low-resistance and thermal stable ohmic contacts is important for realization of ...
In this paper, an experimental investigation into titanium (Ti) / aluminium (Al)-based ohmic contact...
In this paper, an experimental investigation into titanium (Ti) / aluminium (Al)-based ohmic contac...
This paper presents a detailed physical and electrical analysis of 4H-SiC ohmic contacts to p-type m...
This paper describes successfully formed ohmic contacts to p-type 4H-SiC based on titanium-aluminum ...
International audienceThe high-temperature functionality of SiC devices is useless without ohmic con...
TLM structures on Al-implanted regions with different implanted Al concentrations and different anne...
We present the results of TiNiTiAu multilayer ohmic contacts on n -type 6H-SiC and their interface a...
Effects of reducing annealing temperature on a technique for the simultaneous formation of Ni/Al ohm...
In this work, we have investigated triple and innovative multiple stacked contacts onto p-type SiC i...
International audienceThe stability and reliability at high temperature of Ti3SiC2 based ohmic conta...
This paper presents an experimental investigation into different metallisation structures aimed at r...
International audienceTransfer Length Method (TLM) based-structures were fabricated on 0.8 µm-thick ...
This study deals with the interfacial reactions and electrical properties of Ta/4H-SiCcontacts. Tant...
SiC is a promising wide bandgap semiconductor material for active electronic devices. An important p...
The fabrication of low-resistance and thermal stable ohmic contacts is important for realization of ...
In this paper, an experimental investigation into titanium (Ti) / aluminium (Al)-based ohmic contact...
In this paper, an experimental investigation into titanium (Ti) / aluminium (Al)-based ohmic contac...
This paper presents a detailed physical and electrical analysis of 4H-SiC ohmic contacts to p-type m...
This paper describes successfully formed ohmic contacts to p-type 4H-SiC based on titanium-aluminum ...
International audienceThe high-temperature functionality of SiC devices is useless without ohmic con...
TLM structures on Al-implanted regions with different implanted Al concentrations and different anne...
We present the results of TiNiTiAu multilayer ohmic contacts on n -type 6H-SiC and their interface a...
Effects of reducing annealing temperature on a technique for the simultaneous formation of Ni/Al ohm...
In this work, we have investigated triple and innovative multiple stacked contacts onto p-type SiC i...
International audienceThe stability and reliability at high temperature of Ti3SiC2 based ohmic conta...
This paper presents an experimental investigation into different metallisation structures aimed at r...
International audienceTransfer Length Method (TLM) based-structures were fabricated on 0.8 µm-thick ...
This study deals with the interfacial reactions and electrical properties of Ta/4H-SiCcontacts. Tant...
SiC is a promising wide bandgap semiconductor material for active electronic devices. An important p...
The fabrication of low-resistance and thermal stable ohmic contacts is important for realization of ...