Nonequilibrium growth of intermetallics at the interface of liquid-solid metal

The growth characteristic of intermetallics during the reaction of solid (Cu,Ag,Au,Fe,Co,Ni,etc) with liquid (Sn,Sb,Bi,Zn) within a very short time of 1～ 2 s at different temperatures has been studied by metallographic method for explaining the process in the fillet during soldering. It is indicated...The growth characteristic of intermetallics during the reaction of solid (Cu, Ag, Au, Fe, Co, Ni, etc) with liquid (Sn, Sb, Bi, Zn) within a very short time of 1 similar to 2 s at different temperatures has been studied by metallographic method for explaining the process in the fillet during soldering. It is indicated that the incongruent compourds often grow up as bamboo shoot form. But congruent compounds grow up basically just by spreading out as a layer along the solid border. Base on these facts, the influence of intermetallics in the fillet during soldering has been discussed.http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000168819200015&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=8e1609b174ce4e31116a60747a720701SCI(E)中文核心期刊要目总览(PKU)中国科学引文数据库(CSCD)705453-4561