This thesis is part of a project FUI ”Plug InNano”. Objective of the project is offering a new composite conductor, instead of Gold used as a coating conductor in microwave and automotive connectors. An analytical model of the microwave signal behavior has been achieved in composite conductive materials according to their microstructure, especially the case of a multilayer structure. A microwave characterization was performed by measuring the quality factors of microwave coplanarresonators (half-wavelength line and ring), made in the laboratory, to determine the effective electrical conductivity of this new conductor. In parallel, 3D finite element simulations were conducted, and analytical models for losses calculation have been developed ...
In this work both the interconnections and materials used in multi-chip modules (MCMs) at microwave ...
L’industrie a besoin de nouveaux matériaux dont la complexité et la fonctionnalité sont de plus en p...
In this work both the interconnections and materials used in multi-chip modules (MCMs) at microwave ...
This thesis is part of a project FUI ”Plug InNano”. Objective of the project is offering a new compo...
Cette thèse s’intègre dans le cadre d’un projet FUI « Plug InNano » dont l’objectif est de proposer ...
International audienceThe aim of this work is to characterize the electrical conductivity of composi...
The main concern of this thesis is the characterization of the impacts of some composite materials o...
Ce manuscrit se focalise sur l’effet de divers matériaux composites sur les différentes problématiqu...
Electromagnetic material characterization is constantly increasing due to many industrial applicatio...
Composite materials are widely used in the automotive industry as structural components. By combinin...
Les matériaux composites sont largement utilisés dans l'industrie automobile comme pièces de structu...
Electromagnetic interference has become a major problem for the design of electronic and electric de...
Thèse préparé en collaboration avec l'Université Fédérale du Rio Grande do Norte.Metamaterials have ...
Cette thèse entre dans le cadre d’un projet de recherche intitulé Electromagnetic Characterization o...
Premi extraordinari doctorat curs 2010-2011, àmbit d’Enginyeria de les TICThe telecommunications in...
In this work both the interconnections and materials used in multi-chip modules (MCMs) at microwave ...
L’industrie a besoin de nouveaux matériaux dont la complexité et la fonctionnalité sont de plus en p...
In this work both the interconnections and materials used in multi-chip modules (MCMs) at microwave ...
This thesis is part of a project FUI ”Plug InNano”. Objective of the project is offering a new compo...
Cette thèse s’intègre dans le cadre d’un projet FUI « Plug InNano » dont l’objectif est de proposer ...
International audienceThe aim of this work is to characterize the electrical conductivity of composi...
The main concern of this thesis is the characterization of the impacts of some composite materials o...
Ce manuscrit se focalise sur l’effet de divers matériaux composites sur les différentes problématiqu...
Electromagnetic material characterization is constantly increasing due to many industrial applicatio...
Composite materials are widely used in the automotive industry as structural components. By combinin...
Les matériaux composites sont largement utilisés dans l'industrie automobile comme pièces de structu...
Electromagnetic interference has become a major problem for the design of electronic and electric de...
Thèse préparé en collaboration avec l'Université Fédérale du Rio Grande do Norte.Metamaterials have ...
Cette thèse entre dans le cadre d’un projet de recherche intitulé Electromagnetic Characterization o...
Premi extraordinari doctorat curs 2010-2011, àmbit d’Enginyeria de les TICThe telecommunications in...
In this work both the interconnections and materials used in multi-chip modules (MCMs) at microwave ...
L’industrie a besoin de nouveaux matériaux dont la complexité et la fonctionnalité sont de plus en p...
In this work both the interconnections and materials used in multi-chip modules (MCMs) at microwave ...