International audienceIn this paper the consumption of Flash Floating Gate cell, during a channel hot electron operation, is investigated. We characterize the device using different ramp and box pulses on control gate, to find the best solution to have low energy consumption and good cell performances and reliability. We use a new dynamic method to measure the drain current absorption in order to evaluate the impact of different bias conditions, and to study the cell behavior. The programming window and the energy consumption are considered as fundamental parameters. Using this dynamic technique, three zones of work are found; it is possible to optimize the drain voltage during the programming operation to minimize the energy consumption. M...
Low power consumption, virtually zero latency, extremely fast boot-up for OS and applications, fast ...
Flash memories are the leader among nonvolatile memory technologies. Ionizing radiation impact their...
The impact of technological parameter (channel doping, source/drain junction depth) variation and ch...
International audienceThe problem of energy saving has today a relevant importance, concerning in pa...
In this paper, we report an extensive study of drain disturb in isolated cells under Channel Hot Ele...
The origin of drain disturb in NOR Flash EEPROM cells under Channel Initiated Secondary Electron (CH...
International audienceIn this paper the impact of the endurance degradation on the programming windo...
A new hot electron writing scheme for Flash EEPROM's is proposed that combines a positive source to ...
International audienceNowadays, the study of physical mechanisms that occur during Flash memory cell...
We have addressed the problem of threshold voltage (VTH) variation in Flash memory cells after heavy...
In this paper, a complete study of the cell reliability based on a unique oxide damage characterizat...
In this work, we demonstrate the feasibility of using channel initiated secondary electron (CHISEL) ...
In this work, we demonstrate the feasibility of using Channel Initiated Secondary Electron (CHISEL) ...
Floating Gate (FG) memories, and in particular Flash, are the most important player in nowadays nonv...
Multi-level (ML) storage is becoming an important option to achieve high-density flash EEPROMs. This...
Low power consumption, virtually zero latency, extremely fast boot-up for OS and applications, fast ...
Flash memories are the leader among nonvolatile memory technologies. Ionizing radiation impact their...
The impact of technological parameter (channel doping, source/drain junction depth) variation and ch...
International audienceThe problem of energy saving has today a relevant importance, concerning in pa...
In this paper, we report an extensive study of drain disturb in isolated cells under Channel Hot Ele...
The origin of drain disturb in NOR Flash EEPROM cells under Channel Initiated Secondary Electron (CH...
International audienceIn this paper the impact of the endurance degradation on the programming windo...
A new hot electron writing scheme for Flash EEPROM's is proposed that combines a positive source to ...
International audienceNowadays, the study of physical mechanisms that occur during Flash memory cell...
We have addressed the problem of threshold voltage (VTH) variation in Flash memory cells after heavy...
In this paper, a complete study of the cell reliability based on a unique oxide damage characterizat...
In this work, we demonstrate the feasibility of using channel initiated secondary electron (CHISEL) ...
In this work, we demonstrate the feasibility of using Channel Initiated Secondary Electron (CHISEL) ...
Floating Gate (FG) memories, and in particular Flash, are the most important player in nowadays nonv...
Multi-level (ML) storage is becoming an important option to achieve high-density flash EEPROMs. This...
Low power consumption, virtually zero latency, extremely fast boot-up for OS and applications, fast ...
Flash memories are the leader among nonvolatile memory technologies. Ionizing radiation impact their...
The impact of technological parameter (channel doping, source/drain junction depth) variation and ch...