Power consumption and heat dissipation become key elements in the field of high-end integrated circuits, especially those used in mobile and high-speed applications, due to their increase of transistor count and clock frequencies. Dynamic thermal management strategies have been proposed and implemented in order to mitigate heat dissipation. However, there is a lack of a tool that can be used to evaluate DTM strategies and thermal response of real life systems. Therefore, in this paper we introduce and define the concepts of thermal benchmark software and power benchmark software as a software application for run-time system level thermal and power characterizatio
Power electronic system design is typically constrained by the thermal limitation so by the overall ...
As side effects of the end of Dennard’s scaling, power and thermal technological walls stand in fron...
Apart from protecting electrical machines from temperature related failures, thermal management of e...
Power consumption and heat dissipation become key elements in the field of high-end integrated circu...
AbstractHigh performance systems bring high temperatures, which result in decreased lifetime reliabi...
With the increasing clock rate and transistor count of to-day’s microprocessors, power dissipation i...
Fueled by increasing human appetite for high computing performance, semiconductor technology has now...
Over the past decades, the shrinking transistor size enabled more transistors to be integrated into ...
This thesis sets out a series of new techniques to improve the thermal management of power electroni...
Over the past decades, the shrinking transistor size enabled more transistors to be integrated into ...
Editor's note: Thermal management in high-performance multicore platforms has become exceedingly com...
The register file is one of the hottest devices in processor-based systems. Leakage reduction techni...
With continuous IC(Integrated Circuit) technology size scaling, more and more transistors are integr...
Constraining the temperature of computing systems has become a dominant design aspect. The supply vo...
The high power density of a many-core processor results in increased temperature which negatively im...
Power electronic system design is typically constrained by the thermal limitation so by the overall ...
As side effects of the end of Dennard’s scaling, power and thermal technological walls stand in fron...
Apart from protecting electrical machines from temperature related failures, thermal management of e...
Power consumption and heat dissipation become key elements in the field of high-end integrated circu...
AbstractHigh performance systems bring high temperatures, which result in decreased lifetime reliabi...
With the increasing clock rate and transistor count of to-day’s microprocessors, power dissipation i...
Fueled by increasing human appetite for high computing performance, semiconductor technology has now...
Over the past decades, the shrinking transistor size enabled more transistors to be integrated into ...
This thesis sets out a series of new techniques to improve the thermal management of power electroni...
Over the past decades, the shrinking transistor size enabled more transistors to be integrated into ...
Editor's note: Thermal management in high-performance multicore platforms has become exceedingly com...
The register file is one of the hottest devices in processor-based systems. Leakage reduction techni...
With continuous IC(Integrated Circuit) technology size scaling, more and more transistors are integr...
Constraining the temperature of computing systems has become a dominant design aspect. The supply vo...
The high power density of a many-core processor results in increased temperature which negatively im...
Power electronic system design is typically constrained by the thermal limitation so by the overall ...
As side effects of the end of Dennard’s scaling, power and thermal technological walls stand in fron...
Apart from protecting electrical machines from temperature related failures, thermal management of e...