Minimizing the Bondline Thermal Resistance in Thermal Interface Materials Without Affecting Reliability

Electronic assemblies thermal interface materials As electronic assemblies become more compact, with increased processing bandwidth and higher energy fluxes, thermal management is limiting several critical applications. The major technology limitation is the nonmetallic joining of devices to heat sinks using existing commercial thermal interface materials (TIMs). The present study starts a systematic study of the coupled interactions between materials formulation, manufacturing process, and thermal performance