In this article, we present a convex optimization model to design a stacked hybrid memory system to improve performance and reduce energy consumption of the chip-multiprocessor (CMP). Our convex model optimizes numbers and placement of SRAM and STT-RAM memories on the memory layer, and efficiently maps applications/threads on cores in the core layer. Power consumption that is the main challenge in the dark silicon era is represented as a power constraint in this work and it is satisfied by the detailed optimization model in order to design a dark silicon aware 3D CMP. Experimental results show that the proposed architecture considerably improves the energy-delay product (EDP) and performance of the 3D CMP compared to the Baseline memory des...
The emergence of dark silicon - a fundamental design constraint absent in the past generations - bri...
To sustain processor performance, demand for memory capacity and bandwidth continues to grow. Comput...
none43D integration based on TSV (through silicon via) technology enables stacking of multiple memor...
In this article, we present a convex optimization model to design a stacked hybrid memory system for...
In this article, we present a convex optimization model to design a three dimension (3D)stacked hybr...
Main memories play an important role in overall energy consumption of embedded systems. Using conven...
Uncore components such as on‐chip memory systems and on‐chip interconnects consume a large amount of...
Energy consumption becomes the most critical limitation on the performance of nowadays embedded syst...
Management of a problem recently known as “dark silicon” is a new challenge in multicore designs. Pr...
The cost of transferring data between the off-chip memory system and compute unit is the fundamental...
none4siEnergy efficiency is the major optimization criterion for systems-on-chip (SoCs) for mobile d...
The number of concurrently executing processes and their memory demandin multicore systems continue ...
Energy efficiency is the key driver for the design optimization of System-on-Chips for mobile termi...
Continuous semiconductor technology scaling and the rapid increase in computational needs have stimu...
The emergence of dark silicon - a fundamental design constraint absent in past generations - brings ...
The emergence of dark silicon - a fundamental design constraint absent in the past generations - bri...
To sustain processor performance, demand for memory capacity and bandwidth continues to grow. Comput...
none43D integration based on TSV (through silicon via) technology enables stacking of multiple memor...
In this article, we present a convex optimization model to design a stacked hybrid memory system for...
In this article, we present a convex optimization model to design a three dimension (3D)stacked hybr...
Main memories play an important role in overall energy consumption of embedded systems. Using conven...
Uncore components such as on‐chip memory systems and on‐chip interconnects consume a large amount of...
Energy consumption becomes the most critical limitation on the performance of nowadays embedded syst...
Management of a problem recently known as “dark silicon” is a new challenge in multicore designs. Pr...
The cost of transferring data between the off-chip memory system and compute unit is the fundamental...
none4siEnergy efficiency is the major optimization criterion for systems-on-chip (SoCs) for mobile d...
The number of concurrently executing processes and their memory demandin multicore systems continue ...
Energy efficiency is the key driver for the design optimization of System-on-Chips for mobile termi...
Continuous semiconductor technology scaling and the rapid increase in computational needs have stimu...
The emergence of dark silicon - a fundamental design constraint absent in past generations - brings ...
The emergence of dark silicon - a fundamental design constraint absent in the past generations - bri...
To sustain processor performance, demand for memory capacity and bandwidth continues to grow. Comput...
none43D integration based on TSV (through silicon via) technology enables stacking of multiple memor...