International audienceAdhesive bonding presents several assets compared to classical assembly solutions. The determination of the failure assembly strength is a key issue to enhance reliability of such structure. Yet, the design methodology are quite rare. In this study, a model able to predict the failure of bonded assemblies has been develloped. The model is based on failure criterion based on a coupled stress and energetic approaches. In order to reduce the computationnal cost and to adjust with Design Office requirements, this model has been developped with a semi-analytical approach. A first experimental validation has been performed with the modified Arcan devices. The comparison between the experimental and the numerical results are ...