CVD Growth of SiC on Novel Si Substrates

Silicon Carbide has been a semiconductor material of interest as a high power and temperature replacement for Silicon (Si) in harsh environments due to the higher thermal conductivity and chemical stability of SiC. The cost, however, to produce this material is quite high. There are also defects in the substrate material (SiC) that penetrate into the active devices layers which are known device killers. Silicon is a material that provides a low cost substrate material for epitaxial growth and does not contain the defects that SiC substrates have. However, the large (~22%) lattice mismatch between Si and SiC creates dislocations at the SiC/Si interface and defects in the SiC epitaxial layer. These defects result in high leakage currents in 3C-SiC/Si devices. The main focus of the this research was to reduce or eliminate these defects using novel Si substrates. First a 3C-SiC on Si baseline process was developed under atmospheric pressure conditions consisting of 3 steps - an in-situ hydrogen etch to remove the native oxide, a carbonization step to convert the Si surface to SiC, and finally a growth step to thicken the SiC layer to the desired value. This process was then modified to establish a high-quality, low-pressure 3C-SiC CVD growth process. This LPCVD process was then used to grow 3C-SiC on numerous novel Si substrates, including porous Si, porous 3C-SiC free-standing substrates and SOI substrates which consisted on thin Si films bonded to poly-crystalline SiC plates. The results of these experiments are presented along with suggestions for future work so that device-grade films of 3C-SiC can be developed for various applications