Comparison elements on base the STG DICE cell and the logical element “Exclusive OR” for a content-addressable memory were designed and simulated. The comparison element contains two identical joint groups of transistors that are spaced on the chip by the distance of four micrometers, so the loss of data in STG DICE cell practically excluded. On the characteristics of the new 65-nm CMOS comparison element, we predict the hardness of these item to single event rate (SER) more to hundred times compared to elements on 6-transistors cells and the standard DICE cell with distances 0.5-0.6 μm between mutually sensitive nodes
Technology scaling of CMOS devices has made the integrated circuits vulnerable to single event radia...
We have studied Single Event Effects in static and dynamic registers designed in a quarter micron CM...
Abstract — Ternary content addressable memory (TCAM) is one key component in the dedicated hardware ...
This paper presents the design of hardened translation lookaside buffer based on Spaced Transistor G...
Nanometric CMOS is likely to experience the occurrence of a single event causing a multiple-node ups...
International audienceDual-Interlocked-Cell (DICE) latches are tolerant to SingleEvent Effects (SEE)...
less than the DICE configuration (hence incurring in a smaller over-head in layout and area). Moreov...
Latches based on the Dual Interlocked storage Cell or DICE are very tolerant to Single Event Upsets ...
International audienceSingle Event Effects (SEE) caused by external (neutrons, protons, heavy ions) ...
International audienceIn this paper, we evaluate the temperature influence on the vulnerability to s...
Fully Depleted Silicon on Insulator (FD SOI) technology nodes provide better resistance to single ev...
This paper presents the design of a static RAM cell in 65 nm CMOS technology. A good level of radiat...
As transistor sizes scale down to nanometres dimensions, CMOS circuits become more sensitive to radi...
The 21st century is witnessing a tremendous demand for transistors. Life amenities have incorporated...
We have studied single event effects in static and dynamic registers designed in a quarter micron CM...
Technology scaling of CMOS devices has made the integrated circuits vulnerable to single event radia...
We have studied Single Event Effects in static and dynamic registers designed in a quarter micron CM...
Abstract — Ternary content addressable memory (TCAM) is one key component in the dedicated hardware ...
This paper presents the design of hardened translation lookaside buffer based on Spaced Transistor G...
Nanometric CMOS is likely to experience the occurrence of a single event causing a multiple-node ups...
International audienceDual-Interlocked-Cell (DICE) latches are tolerant to SingleEvent Effects (SEE)...
less than the DICE configuration (hence incurring in a smaller over-head in layout and area). Moreov...
Latches based on the Dual Interlocked storage Cell or DICE are very tolerant to Single Event Upsets ...
International audienceSingle Event Effects (SEE) caused by external (neutrons, protons, heavy ions) ...
International audienceIn this paper, we evaluate the temperature influence on the vulnerability to s...
Fully Depleted Silicon on Insulator (FD SOI) technology nodes provide better resistance to single ev...
This paper presents the design of a static RAM cell in 65 nm CMOS technology. A good level of radiat...
As transistor sizes scale down to nanometres dimensions, CMOS circuits become more sensitive to radi...
The 21st century is witnessing a tremendous demand for transistors. Life amenities have incorporated...
We have studied single event effects in static and dynamic registers designed in a quarter micron CM...
Technology scaling of CMOS devices has made the integrated circuits vulnerable to single event radia...
We have studied Single Event Effects in static and dynamic registers designed in a quarter micron CM...
Abstract — Ternary content addressable memory (TCAM) is one key component in the dedicated hardware ...