peer-reviewedPhotonic Integrated Circuits (PICs) are essential components of optical telecommunication networks. The embedded laser-bar arrays generate high heat fluxes (≈103 W/cm2) — representing some of the highest found in contemporary engineering applications. In order to cool these devices within their temperature tolerance of ±0.1K, a combination of micro-thermoelectrics (μthermoelectrics) and chip-embedded μfluidics has been proposed. To successfully implement a μfluidic cooling system, a μpump is required which can achieve high flow rates (≈10 — 30 ml/min) and differential pressures (≈7 — 35 kPa). State-of-the-art μpumps fulfil these requirements with difficulty, although oscillatory μpumps show promise. An essential compone...
This paper explores the feasibility of using electrostatically actuated diaphragm compressors in a m...
Hydrodynamics in microcavities with cylindrical micropin fin arrays simulating a single layer of a w...
Thermal management in the field of electronic devices has become a challenge due to the recent minia...
Photonic Integrated Circuits (PICs) are essential components of optical telecommunication networks. ...
peer-reviewedMicropumps can play a significant role in thermal management applications, as a compone...
peer-reviewedSome of the largest heat fluxes that can be found in contemporary engineering applicati...
peer-reviewedThe context of this thesis is a microfluidic thermal management solution for a transcei...
Two geometric shape turbulence promoters (circular and square of same areas) of different array patt...
This paper was presented at the 3rd Micro and Nano Flows Conference (MNF2011), which was held at the...
Microfluidic convection cooling is a promising technique for future high power microprocessors, radi...
This report details the heat transfer performance of conical, sharp-tipped heat sinks. Four differen...
AbstractLab on Chip technologies have enabled the possibility of novel μTAS devices (micro Total Ana...
Due to copyright restrictions, the access to the full text of this article is only available via sub...
The current investigation reports the design, fabrication, and characterization of ultra-compact air...
Embedded cooling—an emerging thermal management paradigm for electronic devices—has motivated furthe...
This paper explores the feasibility of using electrostatically actuated diaphragm compressors in a m...
Hydrodynamics in microcavities with cylindrical micropin fin arrays simulating a single layer of a w...
Thermal management in the field of electronic devices has become a challenge due to the recent minia...
Photonic Integrated Circuits (PICs) are essential components of optical telecommunication networks. ...
peer-reviewedMicropumps can play a significant role in thermal management applications, as a compone...
peer-reviewedSome of the largest heat fluxes that can be found in contemporary engineering applicati...
peer-reviewedThe context of this thesis is a microfluidic thermal management solution for a transcei...
Two geometric shape turbulence promoters (circular and square of same areas) of different array patt...
This paper was presented at the 3rd Micro and Nano Flows Conference (MNF2011), which was held at the...
Microfluidic convection cooling is a promising technique for future high power microprocessors, radi...
This report details the heat transfer performance of conical, sharp-tipped heat sinks. Four differen...
AbstractLab on Chip technologies have enabled the possibility of novel μTAS devices (micro Total Ana...
Due to copyright restrictions, the access to the full text of this article is only available via sub...
The current investigation reports the design, fabrication, and characterization of ultra-compact air...
Embedded cooling—an emerging thermal management paradigm for electronic devices—has motivated furthe...
This paper explores the feasibility of using electrostatically actuated diaphragm compressors in a m...
Hydrodynamics in microcavities with cylindrical micropin fin arrays simulating a single layer of a w...
Thermal management in the field of electronic devices has become a challenge due to the recent minia...