Teplyakov, Andrew V.Metal deposition has a wide range of applications in many fields, from nano-fabrications to catalytic reactions. Hence, it is important to understand the basic chemical mechanism of the deposition process. In this work, two major target metals, silver and copper, are investigated for the effective deposition by metalorganic vapor deposition approach. In particular, Chapter 1 gives a general overview of the importance and applications of metal deposition in different fields. Specifically, the reactions of different metalorganic precursors containing either copper or silver are addressed. Chapter 2 describes materials and experimental and computational methods used. Experimental investigation of the deposition of copper an...
This dissertation focuses on the chemistry, detection, and control of metals and metal contaminants ...
Electronic devices and their constituents have scaled down over generations for higher performance, ...
Acetamidinate precursors have shown great promise for atomic layer deposition (ALD) applications, bu...
Teplyakov, Andrew V.As massive attempts are focused on crafting thinner films, the surfaces involved...
With scaling down the size of the features in modern electronic devices, it becomes vital to control...
Conspectus The deposition of thin solid films is central to many industrial applications, and chemic...
Metal-organic chemical vapor deposition (MOCVD) from the tetrameric precursor copper(I) tert-butoxid...
The continued dominance of copper in microelectronic manufacturing is due in part to the techniques ...
Metal deposition on silicon from HF-based solutions is initiated by electrochemical reduction of met...
Metallic films are used to improve optical, chemical, mechanical, magnetic, and electrical propertie...
Trimethylphosphine(hexafluoroacetylacetonato)silver(I) was used as a precursor to deposit silver...
The nucleation and successful growth of copper (Cu) thin films on diffusion barrier/adhesion promote...
A fourth-generation copper metalorganic compound, Cu(I)-2-(tert-butylimino)-5,5-dimethyl-pyrrolidin...
Thesis explores the self- assembly and reaction of molecules on surfaces. Initial focus was on under...
The paper presents the results of an experimental investigation of the morphology of copper and silv...
This dissertation focuses on the chemistry, detection, and control of metals and metal contaminants ...
Electronic devices and their constituents have scaled down over generations for higher performance, ...
Acetamidinate precursors have shown great promise for atomic layer deposition (ALD) applications, bu...
Teplyakov, Andrew V.As massive attempts are focused on crafting thinner films, the surfaces involved...
With scaling down the size of the features in modern electronic devices, it becomes vital to control...
Conspectus The deposition of thin solid films is central to many industrial applications, and chemic...
Metal-organic chemical vapor deposition (MOCVD) from the tetrameric precursor copper(I) tert-butoxid...
The continued dominance of copper in microelectronic manufacturing is due in part to the techniques ...
Metal deposition on silicon from HF-based solutions is initiated by electrochemical reduction of met...
Metallic films are used to improve optical, chemical, mechanical, magnetic, and electrical propertie...
Trimethylphosphine(hexafluoroacetylacetonato)silver(I) was used as a precursor to deposit silver...
The nucleation and successful growth of copper (Cu) thin films on diffusion barrier/adhesion promote...
A fourth-generation copper metalorganic compound, Cu(I)-2-(tert-butylimino)-5,5-dimethyl-pyrrolidin...
Thesis explores the self- assembly and reaction of molecules on surfaces. Initial focus was on under...
The paper presents the results of an experimental investigation of the morphology of copper and silv...
This dissertation focuses on the chemistry, detection, and control of metals and metal contaminants ...
Electronic devices and their constituents have scaled down over generations for higher performance, ...
Acetamidinate precursors have shown great promise for atomic layer deposition (ALD) applications, bu...