Carbon nanotubes (CNTs) are a highly promising material for future interconnects. It is expected that the decoration of CNTs with Cu particles or also the filling of the interspaces between the CNTs with Cu instead of the currently used SiO2 can enhance the performance of CNT-based interconnects. Due to the high aspect ratio of CNTs an appropriate deposition technique has to be applied which is able to coat such structures uniformly. The current work is therefore considered with thermal atomic layer deposition (ALD) of CuxO from the liquid Cu (I) β-diketonate precursor [(nBu3P)2Cu(acac)] and wet oxygen at 135°C on variously pretreated multi-walled CNTs. The different in-situ pre-treatments of the CNTs with oxygen, water vapor and wet oxy...
© 2010 IEEE. Personal use of this material is permitted. However, permission to reprint/republish th...
Since the rediscovery of carbon nanotubes (CNTs) due to the publication of Sumio Iijima's article H...
This poster was presented in the Materials for Advanced Metallization (MAM) 2014 Conference in Chemn...
Carbon nanotubes (CNTs) are a highly promising material for future interconnects. It is expected tha...
The following is the accepted manuscript of the original article: Marcel Melzer, Thomas Waechtler, ...
Carbon nanotubes (CNTs) are a highly promising material for future interconnects. It is expected tha...
Atomic Layer Deposition (ALD) is a cost-effective nanoadditive-manufacturing technique that allows f...
Multi-walled carbon nanotubes tangled in easy-to-fluidize porous balls have been decorated by pure c...
Since the discovery of carbon nanotubes (CNTs) in the early 1990s, there has been enormous interest ...
Since there is a continuous shrinking of feature sizes in ultra-large scale integrated (ULSI) circui...
The following is the accepted manuscript of the original article: Marcel Melzer, Thomas Waechtler, ...
The following is the accepted manuscript of the original article: Marcel Melzer, Thomas Waechtler, ...
Since the rediscovery of carbon nanotubes (CNTs) due to the publication of Sumio Iijima's article H...
Copper-based multi-level metallization systems in today’s ultralarge-scale integrated electronic ci...
The addition of metal-based nanoparticles on carbon nanotubes (CNT) is a relevant method producing m...
© 2010 IEEE. Personal use of this material is permitted. However, permission to reprint/republish th...
Since the rediscovery of carbon nanotubes (CNTs) due to the publication of Sumio Iijima's article H...
This poster was presented in the Materials for Advanced Metallization (MAM) 2014 Conference in Chemn...
Carbon nanotubes (CNTs) are a highly promising material for future interconnects. It is expected tha...
The following is the accepted manuscript of the original article: Marcel Melzer, Thomas Waechtler, ...
Carbon nanotubes (CNTs) are a highly promising material for future interconnects. It is expected tha...
Atomic Layer Deposition (ALD) is a cost-effective nanoadditive-manufacturing technique that allows f...
Multi-walled carbon nanotubes tangled in easy-to-fluidize porous balls have been decorated by pure c...
Since the discovery of carbon nanotubes (CNTs) in the early 1990s, there has been enormous interest ...
Since there is a continuous shrinking of feature sizes in ultra-large scale integrated (ULSI) circui...
The following is the accepted manuscript of the original article: Marcel Melzer, Thomas Waechtler, ...
The following is the accepted manuscript of the original article: Marcel Melzer, Thomas Waechtler, ...
Since the rediscovery of carbon nanotubes (CNTs) due to the publication of Sumio Iijima's article H...
Copper-based multi-level metallization systems in today’s ultralarge-scale integrated electronic ci...
The addition of metal-based nanoparticles on carbon nanotubes (CNT) is a relevant method producing m...
© 2010 IEEE. Personal use of this material is permitted. However, permission to reprint/republish th...
Since the rediscovery of carbon nanotubes (CNTs) due to the publication of Sumio Iijima's article H...
This poster was presented in the Materials for Advanced Metallization (MAM) 2014 Conference in Chemn...