Add to ORKGLow strain mounted lenses, fabricated by a flux-free laser soldering technique using liquid solder droplets followed by a high precision adjustment turning process are presented. The process shows all inorganic, adhesive free bonding of optical components and support structures suitable for optical assemblies and instruments especially for aerospace applications and harsh environmental conditions
Based on the development of an adhering and solderable layer system microoptical subsystems are join...
Solder joining is an all inorganic, adhesive free bonding technique for optical components and suppo...
In this paper we present the development of a compact, thermo-optically stable and vibration and mec...
A novel laser-based soldering technique - Solderjet Bumping - using liquid solder droplets in a flux...
A laser based soldering technique - Solderjet Bumping - using liquid solder droplets in a flux-free ...
A high-precision opto-mechanical breadboard for a lens mount has been assembled by means of a laserb...
Soldering using metallic solder alloys is an alternative to adhesive bonding. Laser-based soldering ...
We present Solderjet Bumping, a laser-based soldering process, as an all inorganic joining technique...
We present Solderjet Bumping, a laser-based soldering process, as an all inorganic joining technique...
Solder joining using metallic solder alloys is an alternative to adhesive bonding. Laser-based solde...
In this paper we present the development of a compact, thermo-optically stable and vibration and mec...
Advanced optical systems of telescopes and scientific instrumentation require high accuracy mounting...
Laser based solder bumping is a highly flexible and fast approach for flux-free soldering of micro-o...
Laser beam soldering is a packaging technology alternative to polymeric adhesive bonding in terms of...
Based on the development of an adhering and solderable layer system microoptical systems are joined ...
Based on the development of an adhering and solderable layer system microoptical subsystems are join...
Solder joining is an all inorganic, adhesive free bonding technique for optical components and suppo...
In this paper we present the development of a compact, thermo-optically stable and vibration and mec...
A novel laser-based soldering technique - Solderjet Bumping - using liquid solder droplets in a flux...
A laser based soldering technique - Solderjet Bumping - using liquid solder droplets in a flux-free ...
A high-precision opto-mechanical breadboard for a lens mount has been assembled by means of a laserb...
Soldering using metallic solder alloys is an alternative to adhesive bonding. Laser-based soldering ...
We present Solderjet Bumping, a laser-based soldering process, as an all inorganic joining technique...
We present Solderjet Bumping, a laser-based soldering process, as an all inorganic joining technique...
Solder joining using metallic solder alloys is an alternative to adhesive bonding. Laser-based solde...
In this paper we present the development of a compact, thermo-optically stable and vibration and mec...
Advanced optical systems of telescopes and scientific instrumentation require high accuracy mounting...
Laser based solder bumping is a highly flexible and fast approach for flux-free soldering of micro-o...
Laser beam soldering is a packaging technology alternative to polymeric adhesive bonding in terms of...
Based on the development of an adhering and solderable layer system microoptical systems are joined ...
Based on the development of an adhering and solderable layer system microoptical subsystems are join...
Solder joining is an all inorganic, adhesive free bonding technique for optical components and suppo...
In this paper we present the development of a compact, thermo-optically stable and vibration and mec...