Confocal micro-Raman spectroscopy allows for spatially resolved measurements of the phonon energy in silicon, which is correlated to mechanical stress. Mechanical stress is a tensorial quantity. For the confocal measurement geometry and certain crystal orientations approximations have been derived in the past which correlate the shift of the Raman frequency to a scalar stress value. For optimization of mono-crystalline solar cell manufacturing steps the determination of induced mechanical stress from the top view perspective is desirable. However, this method is so far restricted to planar wafers or cross sections. we find that the anti-reflection surface texture strongly affects the measurement result. To enable quantitative stress determi...
This paper provides a detailed description explaining how to calculate the relation between the sili...
Stress measurements by Raman spectroscopy have been performed on microelectronic devices. Strain-ind...
Three-dimensional (3D) micro-Raman spectroscopy mapping of mechanical stress induced by Cu through-S...
In this work, we show the latest progress in the confocal micro-Raman spectroscopy for determination...
Micro-Raman spectroscopy has been widely used to measure local stresses in silicon and other cubic m...
Raman spectroscopy is used for measuring stress in microelectronic devices [1] as well as in solar c...
Simultaneous and locally resolved determination of the mechanical stress variation and the free hole...
We report research on the characterization of stresses in relation to defects in multicrystalline si...
Micron-scale characterization of mechanical stresses is essential for the successful design and oper...
The strain-shift coefficient used to convert Raman shifts to strain depends on multiple factors incl...
International audienceWe present the theory underlying the large numerical aperture objective micro-...
Micromachining can result in residual stress in a wafer. This paper puts forward an online measuring...
Local mechanical stresses in semiconductor devices, introduced e.g. by dicing, are an important manu...
textThree-dimensional (3-D) integration as an effective method to overcome the wiring limit imposed ...
Due to assembly processes in microelectronics packaging, semiconductor materials are under undesired...
This paper provides a detailed description explaining how to calculate the relation between the sili...
Stress measurements by Raman spectroscopy have been performed on microelectronic devices. Strain-ind...
Three-dimensional (3D) micro-Raman spectroscopy mapping of mechanical stress induced by Cu through-S...
In this work, we show the latest progress in the confocal micro-Raman spectroscopy for determination...
Micro-Raman spectroscopy has been widely used to measure local stresses in silicon and other cubic m...
Raman spectroscopy is used for measuring stress in microelectronic devices [1] as well as in solar c...
Simultaneous and locally resolved determination of the mechanical stress variation and the free hole...
We report research on the characterization of stresses in relation to defects in multicrystalline si...
Micron-scale characterization of mechanical stresses is essential for the successful design and oper...
The strain-shift coefficient used to convert Raman shifts to strain depends on multiple factors incl...
International audienceWe present the theory underlying the large numerical aperture objective micro-...
Micromachining can result in residual stress in a wafer. This paper puts forward an online measuring...
Local mechanical stresses in semiconductor devices, introduced e.g. by dicing, are an important manu...
textThree-dimensional (3-D) integration as an effective method to overcome the wiring limit imposed ...
Due to assembly processes in microelectronics packaging, semiconductor materials are under undesired...
This paper provides a detailed description explaining how to calculate the relation between the sili...
Stress measurements by Raman spectroscopy have been performed on microelectronic devices. Strain-ind...
Three-dimensional (3D) micro-Raman spectroscopy mapping of mechanical stress induced by Cu through-S...