The incorporation of extremely compact multifunctional microsystems is a highly profitable long-term approach in spacecraft design. These systems bring substantial launch-cost reductions, and enable exciting space exploration and science missions. Silicon microsystems technology is an adequate choice for the multifunctional microsystem development. However, the development of basic microsystems technology cannot be financed within application-specific space missions. Rather, the microsystems technology should be matured through fundamental research. Silicon microsystems technology was used to develop a cold gas microthruster system suitable for minute movements of spacecraft (low Δv). In a hybrid integration, the system unit contains three ...
commercial processes into the design of space electronics is a desirable, cost-effective way to leve...
Advances in electronics technology - more than in any other field - have enabled small satellites to...
Results of wafer level packaging for micro-electro-mechanical systems based on low temperature melti...
The incorporation of extremely compact multifunctional microsystems is a highly profitable long-term...
Microsystem interfaces to the macroscopic surroundings and within the microsystems themselves are fo...
The need to significantly reduce the mass, power, and volume of future scientific spacecraft has res...
Silicon micromachining is an attractive technique for batch production of a wide class of miniaturiz...
In this thesis, components intended for vehicles in space and other extreme environments have been r...
With their extremely low mass and volume, low power consumption and tight integration with electroni...
Bonding techniques intended for assembling space microsystems are studied in this work. One of the l...
The burgeoning new technology of Micro-Electro-Mechanical Systems (MEMS) shows great promise in the ...
Future small satellite systems for both Earth observation as well as deep-space exploration are grea...
Micropropulsion for spacecraft is an enabling technology for many future missions, and may increase ...
The past decades have experienced radical changes in fabrication and mass production of electronic s...
Advanced microfabrication technologies offer the prospect of reducing the weight and size of spacecr...
commercial processes into the design of space electronics is a desirable, cost-effective way to leve...
Advances in electronics technology - more than in any other field - have enabled small satellites to...
Results of wafer level packaging for micro-electro-mechanical systems based on low temperature melti...
The incorporation of extremely compact multifunctional microsystems is a highly profitable long-term...
Microsystem interfaces to the macroscopic surroundings and within the microsystems themselves are fo...
The need to significantly reduce the mass, power, and volume of future scientific spacecraft has res...
Silicon micromachining is an attractive technique for batch production of a wide class of miniaturiz...
In this thesis, components intended for vehicles in space and other extreme environments have been r...
With their extremely low mass and volume, low power consumption and tight integration with electroni...
Bonding techniques intended for assembling space microsystems are studied in this work. One of the l...
The burgeoning new technology of Micro-Electro-Mechanical Systems (MEMS) shows great promise in the ...
Future small satellite systems for both Earth observation as well as deep-space exploration are grea...
Micropropulsion for spacecraft is an enabling technology for many future missions, and may increase ...
The past decades have experienced radical changes in fabrication and mass production of electronic s...
Advanced microfabrication technologies offer the prospect of reducing the weight and size of spacecr...
commercial processes into the design of space electronics is a desirable, cost-effective way to leve...
Advances in electronics technology - more than in any other field - have enabled small satellites to...
Results of wafer level packaging for micro-electro-mechanical systems based on low temperature melti...