Mycronic is a company that manufactures a solder paste printer used to manufacturecircuit boards. Inside the printer solder paste is fed with the help of a screw pump.The solder paste, consisting of relatively soft metals has a tendency to stick to thescrew surface and form particles. These are then detached and passed on in thesystem and can clog the nozzle of the printer. This project investigated the possibilityof creating a model test where different parameters can be varied to evaluate itsinfluence on the amount of solder paste sticking to the surface of the screw. Testingthese parameters directly in the solder paste printer would be time consuming andexpensive.A pin-on-disk set up with some modified parts was used to emulate the solde...
Abstract. The solder paste printing process is an important process in the assembly of Surface Mount...
As the trend toward further miniaturisation of pocket and handheld consumer electronic products cont...
Solder paste is the most widely used bonding material in the assembly of surface mount devices in e...
Purpose: To study the rheological behaviours of lead free solder pastes used for flip-chip assembly ...
The printing of solder pastes through very small stencil apertures required for flip-chip pitch size...
Solder paste plays an important role in the electronic assembly process by providing electrical, mec...
The two most important trends in electronic industry are "miniaturisation" and "increased functional...
The two most important trends in electronic industry are "miniaturisation" and "increased functional...
Lead-free solder paste printing process accounts for majority of the assembly defects in the electro...
Purpose – The purpose of this paper is to develop a quality control tool based on rheological test m...
Although stencil printing is widely used in surface mount technology, it is believed to be the main ...
The stencil printing process is an important process in the assembly of Surface Mount Technology (SM...
One of the more critical aspects of engineering is often understanding the variety of complex materi...
Rheological properties of solder pastes are very important for a high quality surface mount technolo...
Wall-slip plays an important role in characterising the flow behaviour of solder paste materials. Th...
Abstract. The solder paste printing process is an important process in the assembly of Surface Mount...
As the trend toward further miniaturisation of pocket and handheld consumer electronic products cont...
Solder paste is the most widely used bonding material in the assembly of surface mount devices in e...
Purpose: To study the rheological behaviours of lead free solder pastes used for flip-chip assembly ...
The printing of solder pastes through very small stencil apertures required for flip-chip pitch size...
Solder paste plays an important role in the electronic assembly process by providing electrical, mec...
The two most important trends in electronic industry are "miniaturisation" and "increased functional...
The two most important trends in electronic industry are "miniaturisation" and "increased functional...
Lead-free solder paste printing process accounts for majority of the assembly defects in the electro...
Purpose – The purpose of this paper is to develop a quality control tool based on rheological test m...
Although stencil printing is widely used in surface mount technology, it is believed to be the main ...
The stencil printing process is an important process in the assembly of Surface Mount Technology (SM...
One of the more critical aspects of engineering is often understanding the variety of complex materi...
Rheological properties of solder pastes are very important for a high quality surface mount technolo...
Wall-slip plays an important role in characterising the flow behaviour of solder paste materials. Th...
Abstract. The solder paste printing process is an important process in the assembly of Surface Mount...
As the trend toward further miniaturisation of pocket and handheld consumer electronic products cont...
Solder paste is the most widely used bonding material in the assembly of surface mount devices in e...