Ar+H2 plasma cleaning has been described for the surface modification of the steel substrates, which removes oxides and other contaminants from substrate surface effectively leading to a better adhesion of the physical vapor deposited (PVD) coatings. Approximately 1.1-1.3 μm thick TiAlN coatings were deposited on plasma treated (Ar and Ar+H2) and untreated mild steel (MS) substrates. A mechanism has been put forward to explain the effect of plasma treatment on the substrate surface based upon the data obtained from X-ray photoelectron spectroscopy (XPS), field emission scanning electron microscopy (FESEM) and atomic force microscopy (AFM). The XPS measurements on untreated and Ar+H2 plasma etched MS substrates indicated that the untreate...
The current semiconductor device manufacturing requires more strict control of plasma etching. In th...
The use of gas and/or liquid-phase carbon dioxide (CO2) with atmospheric plasma discharge surface pr...
Surface engineering has been explored using plasma enhanced chemical vapur deposition (PECVD) of SiO...
Ar+H2 plasma cleaning has been described for the surface modification of the steel substrates, which...
In recent years, Tata Steel Europe has increased their focus on Physical Vapor Deposition (PVD) for ...
Coating deposition by Physical Vapour Deposition (PVD) on high strength steels is an important resea...
We performed open-air plasma treatment of polytetrafluoroethylene (PTFE) at atmospheric pressure to ...
The development of clean and efficient high vacuum technologies to replace traditional methods for m...
A major obstacle in the implementation of extreme ultraviolet (EUV) light photolithography in produc...
The effect of H2–Ar plasma pre-treatment prior to thermal atomic layer deposition (ALD) and plasma-e...
The effect of substrate surface treatment (substrate sputter cleaning) in a cathodic arc plasma prio...
The surface of high-performance poly(ethylene terephthalate) (PET) fibers is difficult to wet and im...
The primary objective of this study was to investigate and compare the surface topography of hard co...
In order to improve the adhesion of hard coatings such as CrN, a surface pretreatment by the novel h...
The effect of substrate surface treatment (substrate sputter cleaning) in a cathodic arc plasma prio...
The current semiconductor device manufacturing requires more strict control of plasma etching. In th...
The use of gas and/or liquid-phase carbon dioxide (CO2) with atmospheric plasma discharge surface pr...
Surface engineering has been explored using plasma enhanced chemical vapur deposition (PECVD) of SiO...
Ar+H2 plasma cleaning has been described for the surface modification of the steel substrates, which...
In recent years, Tata Steel Europe has increased their focus on Physical Vapor Deposition (PVD) for ...
Coating deposition by Physical Vapour Deposition (PVD) on high strength steels is an important resea...
We performed open-air plasma treatment of polytetrafluoroethylene (PTFE) at atmospheric pressure to ...
The development of clean and efficient high vacuum technologies to replace traditional methods for m...
A major obstacle in the implementation of extreme ultraviolet (EUV) light photolithography in produc...
The effect of H2–Ar plasma pre-treatment prior to thermal atomic layer deposition (ALD) and plasma-e...
The effect of substrate surface treatment (substrate sputter cleaning) in a cathodic arc plasma prio...
The surface of high-performance poly(ethylene terephthalate) (PET) fibers is difficult to wet and im...
The primary objective of this study was to investigate and compare the surface topography of hard co...
In order to improve the adhesion of hard coatings such as CrN, a surface pretreatment by the novel h...
The effect of substrate surface treatment (substrate sputter cleaning) in a cathodic arc plasma prio...
The current semiconductor device manufacturing requires more strict control of plasma etching. In th...
The use of gas and/or liquid-phase carbon dioxide (CO2) with atmospheric plasma discharge surface pr...
Surface engineering has been explored using plasma enhanced chemical vapur deposition (PECVD) of SiO...