This report presents the developmental studes on high Tg bismale-imide resin systems for high temperature applications. Epoxy novolacs (EPN) are a special class of resins belonging to the epoxy resin family showing medium to high functionality. The only limitations of these resins are their glass transition temperature. The Tg of these resins can be improved by blending them with bismale-imide. With this background investigations were carried out to modify an EPN with bismale-imide for high performance applications. The main objectives of this studies are Synthesis three different types of bismile-imide, modification of EPN resin with these bismile-imide and to evaluate these formulation for performance applications. This document summarize...
The tensile fracture mechanics and thermo-mechanical properties of mixtures composed of two kinds of...
Bismaleimide (BMI) resin has great potential in aerospace, electronic, and machinery fields due to i...
The synthesis of a class of bis(imide-amine) curing agents for epoxy matrix resins is discussed. Gla...
This report presents the developmental studes on high Tg bismale-imide resin systems for high temper...
Epoxy-novolac (EPN) resin was modified by blending with in-house-synthesized 1, 3-bis(maleimido) ben...
The objective of this study is to evaluate the properties of cured resins made from blends of epoxy ...
Epoxy-novolac resin was modified with 1,1 prime -(methylenedi-4,1-phenylene) bismaleimide (BMI), and...
ABSTRACT: Bismaleimides (BMI) modified polyethersulfone (PES)-epoxy interpenetrating networks were d...
Novel bismaleimide-modified siliconized epoxy intercrosslinked network systems were developed. Silic...
A diglycidylether of bisphenol A, DGEBA, base epoxy resin has been modified with several different t...
Diglycidyl ether of bisphenol A epoxy resin (DGEBA) was toughened with 5%, 10%and 15 % (by wt) of ca...
ABSTRACT: Bisphenol A epoxy resin is blended with different phenolic novolac resins for property mod...
This thesis aims to develop new toughened systems for epoxy resin via physical and chemical modific...
[[abstract]]©2002 Wiley - A novel soluble phosphorus-containing bismaleimide (BMI) monomer, bis(3-ma...
ABSTRACT: A novel soluble phosphorus-containing bismaleimide (BMI) monomer, bis(3-maleimidophenyl)ph...
The tensile fracture mechanics and thermo-mechanical properties of mixtures composed of two kinds of...
Bismaleimide (BMI) resin has great potential in aerospace, electronic, and machinery fields due to i...
The synthesis of a class of bis(imide-amine) curing agents for epoxy matrix resins is discussed. Gla...
This report presents the developmental studes on high Tg bismale-imide resin systems for high temper...
Epoxy-novolac (EPN) resin was modified by blending with in-house-synthesized 1, 3-bis(maleimido) ben...
The objective of this study is to evaluate the properties of cured resins made from blends of epoxy ...
Epoxy-novolac resin was modified with 1,1 prime -(methylenedi-4,1-phenylene) bismaleimide (BMI), and...
ABSTRACT: Bismaleimides (BMI) modified polyethersulfone (PES)-epoxy interpenetrating networks were d...
Novel bismaleimide-modified siliconized epoxy intercrosslinked network systems were developed. Silic...
A diglycidylether of bisphenol A, DGEBA, base epoxy resin has been modified with several different t...
Diglycidyl ether of bisphenol A epoxy resin (DGEBA) was toughened with 5%, 10%and 15 % (by wt) of ca...
ABSTRACT: Bisphenol A epoxy resin is blended with different phenolic novolac resins for property mod...
This thesis aims to develop new toughened systems for epoxy resin via physical and chemical modific...
[[abstract]]©2002 Wiley - A novel soluble phosphorus-containing bismaleimide (BMI) monomer, bis(3-ma...
ABSTRACT: A novel soluble phosphorus-containing bismaleimide (BMI) monomer, bis(3-maleimidophenyl)ph...
The tensile fracture mechanics and thermo-mechanical properties of mixtures composed of two kinds of...
Bismaleimide (BMI) resin has great potential in aerospace, electronic, and machinery fields due to i...
The synthesis of a class of bis(imide-amine) curing agents for epoxy matrix resins is discussed. Gla...