A study of microstructure control of kinetically sprayed metal oxide coating layer

however, the addition of TiO2 particles facilitated NiO deposition. The minimum TiO2 fraction that enabled NiO particle deposition was ~4.8 vol%. Microstructural analysis revealed that TiO2 powder agglomerates tended to break up as the NiO particles impacted the substrate surface, creating a ???deposition complement??? from the excess kinetic energy. The deposition mechanism was investigated using microstructural analysis, electron probe microanalysis, and Brunauer???Emmett???Teller (BET) measurementsthe results confirmed the influence of the TiO2 on NiO particles deposition, specifically, an improvement in the adhesion and density of the NiO particle. Tungsten oxide (WO3) base electrochromic (EC) devices were fabricated by a kinetic spray technique, and characterized controlling of microstructure with varying substrate heating temperatures, particle sizes and phases. The optimal heating condition for WO3 deposition was 80??C, which provided a total transmittance change of 31%. The uniform and densely packed microstructure that resulted from the heated substrate had good intergrain connections that provided sufficient absorption sites for Li ions and improved electron movement inside the film. In addition, the total transmittance change of the deposited WO3 film containing crystalline nano-sized WO3 particles was 56% at 800 nm. Moreover, the charge density of the EC film using crystalline nano-sized WO3 particles was 22.06 mC cm???2. Using crystalline nano-sized WO3 particles greatly increased the number of absorption sites for Li ions inside the film, and thereby improved the charge density and transmittance. The transmittance change of the EC films using dual-phased nano-sized WO3 particles was 64% (at 800 nm), which was still higher than that with crystalline nano-sized WO3 particles. The amorphous phase in the dual-phase nano-sized WO3 film provided good diffusion of Li ionsit had a high diffusion coefficient of 1.53 ?? 10???12 cm2 s???1 that derived from its loosely packed atomic structure. It was established that microstructural control of the EC and ion storage layers with various parameter control such as substrate heating, particle sizes and phases are crucial to improving EC performance.???????????? ????????? ????????? ?????? ???????????? ????????? ???????????? ????????? ??? ?????? ????????? ???????????? ????????? ????????????. ???????????? ????????? ????????? ??????, ?????? ???????????? ????????? ?????? ???????????? ?????? ??????, ?????? ?????? ??????, ?????????, ????????? ?????? ?????? ?????? ????????? ??? ??????. ?????? ???????????? ????????? ????????? ?????????, ????????? ????????? ???????????? ?????? ????????? ????????? ????????? ?????? ???????????? ?????? ????????? ?????? ??????????????? ???????????? ???????????? ????????? ?????? ??? ?????? ????????? ??????. ???????????? ????????? ????????? ???????????? ????????? ?????? ?????? ????????? ????????? ???????????? ?????? ???????????? ?????? (kinetic spray) ????????? ???????????? ??? ????????? ????????? ?????? ?????? ???????????? ???????????? ??????. ??? ??? ??????????????? cold spray (?????? cold gas dynamic spray), aerosol deposition method (ADM), ??? nano particle deposition system (NPDS)??? ?????????, ????????? ???????????? ?????? ????????? ???????????? ????????? ??? ?????? ???????????? ?????? ?????? ?????? ??????. ????????? ???????????? ????????? ???, ??? ?????? ?????? ?????? ????????? ???????????? ???????????? ???????????? ????????? ????????? ????????? ?????? ?????? ????????? ??????. ?????? ??????????????? ????????? ???????????? ?????? ????????? ??????, ????????? ?????? ?????? ???????????? ??????????????? ???????????? ???????????? ??????. ????????? ???????????? ???????????? ??? ????????? ????????? ?????? ?????? ????????? ???????????? ????????? ????????? ????????? ????????? ?????????, ??????????????? ???????????? ????????? ????????? ?????????????????? ???????????? ???????????? ?????? ??????. ??? ??????????????? ????????? ???????????? ???????????? ?????? ????????? ???????????? ?????? ????????? ????????? ?????? ???, ????????????, ??????, ???, ??????, ???????????? ?????? ????????? ??????????????? ????????? ??????????????????, ?????? ?????? ??? ????????? ?????? ???????????? ?????? ???????????? ?????????????????? ????????? ???????????? ????????? ????????? ???????????? ???????????? ????????? ??? ????????? ??????????????? ?????? ????????? ???????????? ????????? ???????????????. ?????? ?????? ????????? ?????? (NiO)??? ???????????? ????????? ??????????????????, ?????? ????????? ??????, ????????? ?????? ???????????? ??????????????? ????????? ????????? ???????????????. ??? ?????? 100 nm ????????? ???????????? ????????? ?????? ??????????????? ???????????? ?????? ????????? ??? ?????????. ?????? ????????? 100 nm ????????? ?????? ????????? ????????? ?????? ??? ?????? ?????? ?????? ????????? ?????? ????????? ?????? ?????? ???????????????. 100 nm ????????? ?????? ????????? ?????? ?????? ??????????????? ????????? ????????? ????????? ????????????, ???????????? ????????? ??????????????? ?????? ?????? ???????????? ???????????? ????????? ???????????? ?????? ?????? ????????? ???????????? ???????????? ??? ????????? ????????? ????????? ?????? ?????? ??? ??? ?????????. 100 nm ?????? ????????? ?????? ???????????? ???????????? ?????? ???????????? ?????? ????????? ????????? ???????????? ?????????, ????????? ?????? ??? ???????????? ???????????? ????????? ??????????????? ?????? ???????????? ?????? ??????????????? ????????? ???????????? ?????????. ????????? ??? ????????? ????????? ????????? ???????????? ?????? ???????????? ?????? ????????? ?????? ??????????????? ?????? ???????????? ?????? ????????? ????????? ?????? ?????? ??????????????? ???????????? ?????? ??????????????? ?????? ??? ??? ????????????, ????????? ????????? ?????? ????????? ???????????? ??????????????? ???????????? ????????? ????????? ??????????????? ??????????????? ????????? ????????? ??? ?????????. ???????????? ???????????? ????????? ?????? ??????(NiO)??? ???????????? ?????? ??? ?????? ???????????? ????????? ??????????????? ?????? ????????? ???????????????, ?????? ??????(TiO2)??? ???????????? ????????????, ??????????????? ?????? ??????????????? ????????? ???????????? ?????? ??? ?????? ????????? ???????????????. ?????? ????????? ???????????? ?????? ???????????? ????????? ?????? ????????? ?????? ?????? ?????? ????????? ?????? ??????????????? ????????????, ?????? ????????? ???????????? ?????? ????????? ???????????? ????????? ??? ??? ?????????. ???????????? ??????(NiO)??? ????????? ??? ??? ?????? ?????? ??????????????? 4.8 vol%??? ??????????????????, ???????????? ?????? ?????? ?????? ??????(TiO2) ???????????? ????????? ????????? ???????????? ????????? ????????? ????????? ????????? ?????? ?????? ??? ??? ?????????. ??? ?????? ????????? ????????? ?????? ????????? ????????? ?????????????????? ????????? ???????????????, ??????????????????(EPMA), ???????????? ?????? (BET) ?????? ???????????? ???????????? ?????? ????????? ?????? ?????? ????????? ????????? ????????? ????????? ?????? ???????????? ????????? ???????????? ???????????? ???????????? ?????? ??? ??? ?????????. ?????? ??? ?????? ????????? ?????? ????????? ?????? ?????? ??????, ?????? ?????? ?????? ????????? ???????????? ?????? ???????????? ????????? ???????????? ??????????????? ???????????? ????????? ??? ????????? ???????????????. ????????? ????????? ???????????? ????????? ?????????(WO3) ????????? ??????????????????(Electrochromic device)??? ???????????? ?????? ????????? ???????????? ???????????????, ?????? ????????????, ?????? ?????? ??? ??? ?????? ???????????? ???????????? ????????? ???????????????, ?????? ?????? ???????????? ????????? ????????? ????????? ??????????????? ???????????????. ??? ?????? ?????? ?????? ????????? 80 ?????? ??????????????? ??? 31 %??? ????????? ?????? ????????? ?????? ??? ?????????. ?????? ????????? ????????? ?????? ?????? ??? ????????? ???????????? ???????????? ????????? ????????? ????????? ????????????, ????????? ???????????? ?????????, grain?????? ?????? ????????? ????????? ???????????? ??? ??????. ?????? grain boundary?????? Li ????????? ?????? ??? ??????, ????????? ????????? ????????? ???????????? ???????????? ????????? ??????????????? ???????????? ???????????????. ?????? ???????????? ????????? ????????? ????????? ????????? ?????? 56 % (800 nm ?????????) ????????? ????????? ?????? ????????? ?????? ??? ?????????, charge density??? 22.06 mC cm???2??? ???????????????. ?????? ?????? ????????? ????????? ?????? ?????? ??? ???????????? ????????? ????????? ?????? ?????????????????? ?????? Li ????????? ??????????????? ???????????? ???????????? ??? ??? ?????????. ??????????????? ????????? ????????? ??? ???????????? ??????-??? ????????? ???????????? ?????? ???????????? ????????? ??????????????? ??? 64 %?????? ???????????? ????????? ?????? ???????????? ?????? ???????????????, ????????? ???????????? Li ion??? ??????????????? 1.53 ?? 10???12 cm2 s???1 ?????? ?????? ??? ?????????. ?????? ?????? ????????? ??? ????????? ????????? ?????? ???????????? ????????? ????????? ???????????? ?????? Li????????? ????????? ??????????????? ??????????????? ????????? ??? ?????????. ????????? ??? ????????? ?????? ????????? ???????????? ???????????? ?????? ????????? ???????????? ?????? ????????? ????????? ?????? ??? ????????? ???????????? ?????? ?????? ??????????????? ??????, ????????????, ??????, ???, ??????, ???????????? ?????? ?????? ??????????????? ????????? ???????????? ?????? ??????????????????, ?????? ?????? ??? ????????? ?????? ???????????? ?????? ???????????? ?????????????????? ????????? ???????????? ????????? ????????? ???????????? ???????????? ????????? ??? ????????? ????????? ??? ??? ??? ?????????.Direct printing technology, which is able to deposit from area to patterns, is one of the main category of new manufacturing technologies. Direct printing technology is useful to fabricate functional patterns or structures on various substrate such as metal, ceramic, polymer substrate based on the low temperature and dry manufacturing process. In addition the related environmental issues and the high price of raw materials are great incentives for minimizing waste and the use of toxic materials. Nowadays, many kinds of direct printing systems have been developed and used to fabricate onto any substrate for functional devices. Among those, solid particle based kinetic spray technique, which is represented by cold spray (or cold gas dynamic spray), aerosol deposition method (ADM) and nano particle deposition system (NPDS), and etc. has a lot of potential advantages to related engineering fields. These processes is operated dried condition and do not need pre- or post- treatment and also dry solid particles are deposited at low temperature without any thermal damage on the substrate. Typically, they are used to coat or deposit on a large area of substrate. However still, these processes have not been completely verified and approved to commercialize due to various process parameters related with system and materials. In this dissertation, three subjectsmicrostructure control, deposition mechanism (single, dual-component) and its application in electrochromic device using metal oxide particles via kinetic spray process, were mainly focused and investigated empirically. Firstly, the deposition mechanism of single component system (NiO) particles using kinetic spray technique was investigated. To understand the effects of particle size and substrates on the deposition, nano-, 100-nm-, sub-micro-, and micro-sized NiO particles were deposited on Si wafers, Ni-coated Si wafers, and fluorine-doped tin oxide (FTO)-coated glass. It was found that when the particle size was greater than 100 nm, the deposition was due primarily to deformation and fracturing during the collision with the substrate. In particular, the 100-nm-sized NiO particles showed both mechanisms, a two-step process, with deformation or fracturing at the interface between the substrate and particles, followed by a loosely compacted coating layer forming, preserving the original particle shape. Thus, it was confirmed that the 100-nm-sized NiO particles were at or near a boundary for deposition mechanisms. The effects of particle size and substrate for dry deposition were explained successfully by assessing the deposition behavior using analytical tools. Moreover, kinetic spray technique with TiO2 particles was used to deposit NiO particles onto a fluorine-doped tin oxide (FTO) substrate to demonstrate the deposition mechanism of dual component powder mixture. Initially, in the absence of TiO2 powder, we observed that the NiO particles did not adhere to the substrateDocto