Photonic Integrated Circuits (PICs) are essential components of optical telecommunication networks. The embedded laser-bar arrays generate high heat fluxes (≈103 W/cm2) — representing some of the highest found in contemporary engineering applications. In order to cool these devices within their temperature tolerance of ±0.1K, a combination of micro-thermoelectrics (μthermoelectrics) and chip-embedded μfluidics has been proposed. To successfully implement a μfluidic cooling system, a μpump is required which can achieve high flow rates (≈10 — 30 ml/min) and differential pressures (≈7 — 35 kPa). State-of-the-art μpumps fulfil these requirements with difficulty, although oscillatory μpumps show promise. An essential component of oscillatory val...
This Paper reports the design, simulation and test of 3D microchannel networks intended for the 3D I...
Embedded cooling—an emerging thermal management paradigm for electronic devices—has motivated furthe...
This Paper reports the design, simulation and test of 3D microchannel networks intended for the 3D I...
Photonic Integrated Circuits (PICs) are essential components of optical telecommunication networks. ...
peer-reviewedMicropumps can play a significant role in thermal management applications, as a compone...
peer-reviewedSome of the largest heat fluxes that can be found in contemporary engineering applicati...
peer-reviewedThe context of this thesis is a microfluidic thermal management solution for a transcei...
Microfluidic convection cooling is a promising technique for future high power microprocessors, radi...
The three-dimensional thermal ground plane was developed in response to the needs of high-power dens...
Two geometric shape turbulence promoters (circular and square of same areas) of different array patt...
AbstractLab on Chip technologies have enabled the possibility of novel μTAS devices (micro Total Ana...
Increased power density and non-uniform heat dissipation present a thermal management challenge in ...
This paper was presented at the 3rd Micro and Nano Flows Conference (MNF2011), which was held at the...
The LHCb VELO Upgrade I, currently being installed for the 2022 start of LHC Run 3, uses silicon mic...
<p> High power diode laser arrays have found increasing applications in the field of pumping solid-...
This Paper reports the design, simulation and test of 3D microchannel networks intended for the 3D I...
Embedded cooling—an emerging thermal management paradigm for electronic devices—has motivated furthe...
This Paper reports the design, simulation and test of 3D microchannel networks intended for the 3D I...
Photonic Integrated Circuits (PICs) are essential components of optical telecommunication networks. ...
peer-reviewedMicropumps can play a significant role in thermal management applications, as a compone...
peer-reviewedSome of the largest heat fluxes that can be found in contemporary engineering applicati...
peer-reviewedThe context of this thesis is a microfluidic thermal management solution for a transcei...
Microfluidic convection cooling is a promising technique for future high power microprocessors, radi...
The three-dimensional thermal ground plane was developed in response to the needs of high-power dens...
Two geometric shape turbulence promoters (circular and square of same areas) of different array patt...
AbstractLab on Chip technologies have enabled the possibility of novel μTAS devices (micro Total Ana...
Increased power density and non-uniform heat dissipation present a thermal management challenge in ...
This paper was presented at the 3rd Micro and Nano Flows Conference (MNF2011), which was held at the...
The LHCb VELO Upgrade I, currently being installed for the 2022 start of LHC Run 3, uses silicon mic...
<p> High power diode laser arrays have found increasing applications in the field of pumping solid-...
This Paper reports the design, simulation and test of 3D microchannel networks intended for the 3D I...
Embedded cooling—an emerging thermal management paradigm for electronic devices—has motivated furthe...
This Paper reports the design, simulation and test of 3D microchannel networks intended for the 3D I...