Deep level Mn doping by ion implantation and RTA have been used for the first time to make very high resistivity Czochralski silicon substrates up to 10 kΩcm and on the average, resistivity increased nearly ten-fold. Interesting features, like trapping by end-of-range defects, out-diffusion and partial activation of Mn dopant atoms were observed
Deep-level doping compensation process using elemental gold is used to create high resistivity silic...
We have processed pin-diodes and strip detectors on n- and p-type high-resistivity silicon wafers gr...
We report on the design, manufacturing and first characterisation of pad diodes, test structures and...
Deep level manganese doping by ion implantation and rapid thermal annealing have been used for the f...
Deep level manganese (Mn) doping has been used to fabricate very high resistivity single crystal sil...
Deep level manganese Mn doping has been used to fabricate very high resistivity single crystal silic...
The possibility of using deep level impurities to obtain 'semi-insulating' Czochralski silicon of ne...
We show that deep level doping of Czochralski-grown silicon wafers is capable of providing high resi...
The rapid development of high speed devices increases the need for high resistivity substrate to imp...
We show that deep level doping of Czochralski-grown silicon wafers is capable of providing high resi...
We investigated how MeV nitrogen ion implantation affects the resistivity transition in Czochralski ...
The requirement for high resistivity single crystal silicon substrates for microwave monolithic inte...
Deep level doping compensation concept using elemental gold is utilised to create effectively high r...
The concept of fully encapsulated, semi-insulating silicon (SI-Si), Czochralski-silicon-on-insulator...
Investigation of auto-oscillation currents in compensated silicon doped with impurity atoms of manga...
Deep-level doping compensation process using elemental gold is used to create high resistivity silic...
We have processed pin-diodes and strip detectors on n- and p-type high-resistivity silicon wafers gr...
We report on the design, manufacturing and first characterisation of pad diodes, test structures and...
Deep level manganese doping by ion implantation and rapid thermal annealing have been used for the f...
Deep level manganese (Mn) doping has been used to fabricate very high resistivity single crystal sil...
Deep level manganese Mn doping has been used to fabricate very high resistivity single crystal silic...
The possibility of using deep level impurities to obtain 'semi-insulating' Czochralski silicon of ne...
We show that deep level doping of Czochralski-grown silicon wafers is capable of providing high resi...
The rapid development of high speed devices increases the need for high resistivity substrate to imp...
We show that deep level doping of Czochralski-grown silicon wafers is capable of providing high resi...
We investigated how MeV nitrogen ion implantation affects the resistivity transition in Czochralski ...
The requirement for high resistivity single crystal silicon substrates for microwave monolithic inte...
Deep level doping compensation concept using elemental gold is utilised to create effectively high r...
The concept of fully encapsulated, semi-insulating silicon (SI-Si), Czochralski-silicon-on-insulator...
Investigation of auto-oscillation currents in compensated silicon doped with impurity atoms of manga...
Deep-level doping compensation process using elemental gold is used to create high resistivity silic...
We have processed pin-diodes and strip detectors on n- and p-type high-resistivity silicon wafers gr...
We report on the design, manufacturing and first characterisation of pad diodes, test structures and...