Recently we have shown how hot-spots during test can be avoided without unnecessarily increasing the testing time by using a thermal-safe test scheduling approach. In this work, we investigate the impact of scan shift frequency scaling on the thermal-safe test scheduling performance and propose an algorithm which embeds shift frequency scaling into the test scheduling process. Experimental results show that this approach offers shorter overall testing times and significantly improved ability of meeting tight thermal constraints when compared to existing thermal-safe test scheduling approach based on a fixed scan shift frequency
Chip overheating has become a critical problem during test of today’s complex core-based systems. In...
Electronic systems have become highly complex, which results in a dramatic increase of both design a...
Many cutting-edge computer and electronic products are powered by advanced Systems-on-Chip (SoC). Ad...
Overheating has been acknowledged as a major problem during the testing of complex system-on-chip (S...
Overheating has been acknowledged as a major issue in testing complex SOCs. Several power constraine...
Abstract—Increasing power densities due to process scaling, combined with high switching activity an...
Overheating has been acknowledged as a ma-jor issue in testing complex SOCs. Several power constrain...
Designing integrated circuits (ICs) has become more challenging when fabrication technology scales d...
Designing integrated circuits (ICs) has become more challenging when fabrication technology scales d...
High temperature gradients in System on Chip (SoC) lowered the performances, reliability and leakage...
High temperature has become a major problem for system-on-chip testing. In order to reduce the test ...
High temperature has become a major problem for system-on-chip testing. In order to reduce the test ...
The SoC test scheduling technique has attracted wide attention of researchers because it reduces the...
The high complexity of modern electronic systems has resulted in a substantial increase in the time-...
Abstract High temperature and process variation are unde-sirable phenomena affecting modern Systems-...
Chip overheating has become a critical problem during test of today’s complex core-based systems. In...
Electronic systems have become highly complex, which results in a dramatic increase of both design a...
Many cutting-edge computer and electronic products are powered by advanced Systems-on-Chip (SoC). Ad...
Overheating has been acknowledged as a major problem during the testing of complex system-on-chip (S...
Overheating has been acknowledged as a major issue in testing complex SOCs. Several power constraine...
Abstract—Increasing power densities due to process scaling, combined with high switching activity an...
Overheating has been acknowledged as a ma-jor issue in testing complex SOCs. Several power constrain...
Designing integrated circuits (ICs) has become more challenging when fabrication technology scales d...
Designing integrated circuits (ICs) has become more challenging when fabrication technology scales d...
High temperature gradients in System on Chip (SoC) lowered the performances, reliability and leakage...
High temperature has become a major problem for system-on-chip testing. In order to reduce the test ...
High temperature has become a major problem for system-on-chip testing. In order to reduce the test ...
The SoC test scheduling technique has attracted wide attention of researchers because it reduces the...
The high complexity of modern electronic systems has resulted in a substantial increase in the time-...
Abstract High temperature and process variation are unde-sirable phenomena affecting modern Systems-...
Chip overheating has become a critical problem during test of today’s complex core-based systems. In...
Electronic systems have become highly complex, which results in a dramatic increase of both design a...
Many cutting-edge computer and electronic products are powered by advanced Systems-on-Chip (SoC). Ad...