As a widely applicable process for fabricating micro- or nanostructures, micromolding in atmosphere would require the removal or minimization of air-trapping in mold cavities so as to fill the liquid prepolymer fully into the mold for generating an exact polymer duplicate. This has been difficult, if not impossible, especially for a mold with high aspect ratio, varying size/shape, or isolated cavities because the air can be trapped inside such mold cavities in most variants of the molding process. This paper presents an electrowetting assisted transfer micromolding process to solve this problem. A feeding blade continuously supplies a UV-curable prepolymer over a dielectric-coated conductive mold placed on a progressively advancing stage. A...
Melt electrowriting (MEW) is an additive manufacturing technique capable of fabricating microfibre t...
Uncapped, hollow polymeric microstructures were fabricated on a silicon substrate using electric fie...
The possibility of using through-mask electrodeposition to fill features with active sidewalls was i...
The ability to generate a large area micropillar array with spatially varying heights allows for exp...
This paper presents an economic method, based on electrically templated dewetting of a UV-curable pr...
The aim of the work presented in this thesis is the development of two computational models of two p...
Micropatterning of functional polymer materials by micromolding in capillaries (MIMIC) with ice mold...
US 6,251,248 B1USA109/4220922001/06/26A microfabrication process for making a microstructure product...
A conventional replication master made of photoresist for microchannel fabrication does not have rep...
Microfluidic devices have been widely used for biomedical and biochemical applications. Due to its u...
Uncapped, hollow polymeric microstructures were fabricated on a silicon substrate using electric fie...
Microfluidic devices have been widely used for biomedical and biochemical applications. Due to its u...
Improving the LIGA technology a method was developed to mold microstructures on processed wafers and...
Electrowetting (EW) is widely used in digital microfluidics for the manipulation of drops sandwiched...
Melt electrowriting (MEW) is an additive manufacturing technique capable of fabricating microfibre t...
Melt electrowriting (MEW) is an additive manufacturing technique capable of fabricating microfibre t...
Uncapped, hollow polymeric microstructures were fabricated on a silicon substrate using electric fie...
The possibility of using through-mask electrodeposition to fill features with active sidewalls was i...
The ability to generate a large area micropillar array with spatially varying heights allows for exp...
This paper presents an economic method, based on electrically templated dewetting of a UV-curable pr...
The aim of the work presented in this thesis is the development of two computational models of two p...
Micropatterning of functional polymer materials by micromolding in capillaries (MIMIC) with ice mold...
US 6,251,248 B1USA109/4220922001/06/26A microfabrication process for making a microstructure product...
A conventional replication master made of photoresist for microchannel fabrication does not have rep...
Microfluidic devices have been widely used for biomedical and biochemical applications. Due to its u...
Uncapped, hollow polymeric microstructures were fabricated on a silicon substrate using electric fie...
Microfluidic devices have been widely used for biomedical and biochemical applications. Due to its u...
Improving the LIGA technology a method was developed to mold microstructures on processed wafers and...
Electrowetting (EW) is widely used in digital microfluidics for the manipulation of drops sandwiched...
Melt electrowriting (MEW) is an additive manufacturing technique capable of fabricating microfibre t...
Melt electrowriting (MEW) is an additive manufacturing technique capable of fabricating microfibre t...
Uncapped, hollow polymeric microstructures were fabricated on a silicon substrate using electric fie...
The possibility of using through-mask electrodeposition to fill features with active sidewalls was i...