Owing to the miniaturization of power electronics and the development of portable and flexible devices, demands for highly thermally conductive, mechanically flexible, and electrically insulating composites have substantially increased. However, the conventional method to improve thermal conductivity usually yields both an undesired value (usually below 10 W m<sup>–1</sup> K<sup>–1</sup>) and poor flexibility. Thus, a combination of all the desired properties together remains a technical challenge. Bioinspired engineering offers great promise in the synthesis and fabrication of thermal materials that are different from engineering through conventional approaches. Inspired by the interface and orientation of natural nacre, we report on therm...
Advanced heat dissipation materials are necessary for powerful and miniaturized electronics. Hexagon...
We investigated thermal properties of the epoxy-based composites with the high loading fractionup t...
Efficient heat dissipation is a prerequisite for further improving the integration of devices. Howev...
With the development of portable and flexible devices, demands for high-performance thermal manageme...
In this work, we report a dielectric nanocomposite paper with layered boron nitride (BN) nanosheets ...
Electrically insulating polymeric nanocomposites with high thermal conductivity have great potential...
With the rapid development of electronic device, thermal management material is currently in great d...
The development of portable and wearable electronic devices has substantially increased the demand f...
The development of thermal conduction polymer-based composites is important to solve the heat dissip...
Dielectric materials with excellent thermally conductive and mechanical properties can enable disrup...
© 2020 Elsevier Ltd High-efficiency thermal management materials have attracted increasingly more at...
Electrically insulating boron nitride (BN) nanosheets possess thermal conductivity similar to and th...
Electrically insulating boron nitride (BN) nanosheets possess thermal conductivity similar to and th...
Electrically insulating boron nitride (BN) nanosheets possess thermal conductivity similar to and th...
Efficient heat dissipation is a prerequisite for further improving the integration of devices. Howev...
Advanced heat dissipation materials are necessary for powerful and miniaturized electronics. Hexagon...
We investigated thermal properties of the epoxy-based composites with the high loading fractionup t...
Efficient heat dissipation is a prerequisite for further improving the integration of devices. Howev...
With the development of portable and flexible devices, demands for high-performance thermal manageme...
In this work, we report a dielectric nanocomposite paper with layered boron nitride (BN) nanosheets ...
Electrically insulating polymeric nanocomposites with high thermal conductivity have great potential...
With the rapid development of electronic device, thermal management material is currently in great d...
The development of portable and wearable electronic devices has substantially increased the demand f...
The development of thermal conduction polymer-based composites is important to solve the heat dissip...
Dielectric materials with excellent thermally conductive and mechanical properties can enable disrup...
© 2020 Elsevier Ltd High-efficiency thermal management materials have attracted increasingly more at...
Electrically insulating boron nitride (BN) nanosheets possess thermal conductivity similar to and th...
Electrically insulating boron nitride (BN) nanosheets possess thermal conductivity similar to and th...
Electrically insulating boron nitride (BN) nanosheets possess thermal conductivity similar to and th...
Efficient heat dissipation is a prerequisite for further improving the integration of devices. Howev...
Advanced heat dissipation materials are necessary for powerful and miniaturized electronics. Hexagon...
We investigated thermal properties of the epoxy-based composites with the high loading fractionup t...
Efficient heat dissipation is a prerequisite for further improving the integration of devices. Howev...