Low-energy ion irradiation of polymer induces different phenomena in the near surface layer, which effect strongly the metal–polymer interface formation and promotes adhesion of polymers to metals. Low-energy argon and oxygen ion beams were used to alter the chemical and physical properties of different polymers (PS (polystyrene), P?MS (poly(?-methylstyrene), BPA-PC (bisphenol-A-polycarbonate) and PMMA (poly(methyl methacrylate)), in order to understand the adhesion phenomena between a deposited Cu layer and the polymers. The resulting changes were investigated by various techniques including X-ray photoelectron spectroscopy, measurements of the metal condensation coefficient and a new technique to measure cross-linking at the polymer surfa...
We have studied the adhesion of a sputtered copper film (thickness 5000 Angstroms) to flexible polyi...
It is known that the adhesive strength of metallic films on polymer substrates often changes in the ...
It is known that the adhesive strength of metallic films on polymer substrates often changes in the ...
Ion–polymer interaction induces different phenomena in the near surface layer of polymers, and promo...
The interface formation between copper and poly(ethylene terephthalate) (PET) and poly(methyl methac...
Low energy ion beam irradiation proved itself to be suitable technique to alter chemical and physica...
Low energy ion beam irradiation proved itself to be suitable technique to alter chemical and physica...
The effects of various surface pretreatments on the adhesion of electroless and sputter-deposited co...
The effects of the different surface modification methods on the adhesion of electroless and sputter...
The effects of the different surface modification methods on the adhesion of electroless and sputter...
Surface modification techniques such as wet chemical etching, oxidizing flames, and plasma treatment...
The surface characteristics of polymers are important factors determining their interfacial properti...
Adhesion is very important in a number of technological applications. The development of new adhesiv...
Adhesion is very important in a number of technological applications. The development of new adhesiv...
Adhesion is very important in a number of technological applications. The development of new adhesiv...
We have studied the adhesion of a sputtered copper film (thickness 5000 Angstroms) to flexible polyi...
It is known that the adhesive strength of metallic films on polymer substrates often changes in the ...
It is known that the adhesive strength of metallic films on polymer substrates often changes in the ...
Ion–polymer interaction induces different phenomena in the near surface layer of polymers, and promo...
The interface formation between copper and poly(ethylene terephthalate) (PET) and poly(methyl methac...
Low energy ion beam irradiation proved itself to be suitable technique to alter chemical and physica...
Low energy ion beam irradiation proved itself to be suitable technique to alter chemical and physica...
The effects of various surface pretreatments on the adhesion of electroless and sputter-deposited co...
The effects of the different surface modification methods on the adhesion of electroless and sputter...
The effects of the different surface modification methods on the adhesion of electroless and sputter...
Surface modification techniques such as wet chemical etching, oxidizing flames, and plasma treatment...
The surface characteristics of polymers are important factors determining their interfacial properti...
Adhesion is very important in a number of technological applications. The development of new adhesiv...
Adhesion is very important in a number of technological applications. The development of new adhesiv...
Adhesion is very important in a number of technological applications. The development of new adhesiv...
We have studied the adhesion of a sputtered copper film (thickness 5000 Angstroms) to flexible polyi...
It is known that the adhesive strength of metallic films on polymer substrates often changes in the ...
It is known that the adhesive strength of metallic films on polymer substrates often changes in the ...