The thermal conductivity of AlN and SiC thin films sputtered on silicon substrates is measured employing the 3 omega method. The thickness of the AlN sample is varied in the range from 200 to 2000 nm to analyze the size effect. The SiC thin films are prepared at two different temperatures, 20 and 500 degrees C, and the effect of deposition temperature on thermal conductivity is examined. The results reveal that the thermal conductivity of the thin films is significantly smaller than that of the same material in bulk form. The thermal conductivity of the AlN thin film is strongly dependent on the film thickness. For the case of SiC thin films, however, increased deposition temperature results in negligible change in the thermal conductivity ...
Thermal conductivity of submicron-thick aluminium oxide thin films prepared by middle frequency magn...
In recent years, a lot of efforts have been made in growth of AlN films because of its promising pot...
AlN-Ceramic is very suitable as carrier substrate for multichip modules because of its high thermal ...
Thickness dependent thermal conductivity measurements were made on aluminum nitride (AlN)thin films ...
International audienceThis Letter reports the thermal conductivity of aluminium nitride (AlN) thin-f...
International audienceThe relationship between thermal conductivity and microstructures of aluminium...
International audienceWe report on thermal conductivity measurements of aluminum nitride (AlN) films...
Thickness dependency and interfacial structure effects on thermal properties of AlN thin films were ...
International audienceThe effect of the structural inhomogeneity and oxygen defects on the thermal c...
Aluminum nitride (AlN) is one of the few electrically insulating materials with excellent thermal co...
International audienceIn this work, we report the implementation of the ultra-fast transient hot str...
The prediction and measurement of the thermal conductivity, k, of crystalline materials, particularl...
For most micro- and nanoelectronic devices based on thin films applied for effective heat dissipatio...
In order to study thermal conductivities of ta-C and SiC>2 thin films, the PPR system was developed....
High thermal conductivity materials show promise for thermal mitigation and heat removal in devices....
Thermal conductivity of submicron-thick aluminium oxide thin films prepared by middle frequency magn...
In recent years, a lot of efforts have been made in growth of AlN films because of its promising pot...
AlN-Ceramic is very suitable as carrier substrate for multichip modules because of its high thermal ...
Thickness dependent thermal conductivity measurements were made on aluminum nitride (AlN)thin films ...
International audienceThis Letter reports the thermal conductivity of aluminium nitride (AlN) thin-f...
International audienceThe relationship between thermal conductivity and microstructures of aluminium...
International audienceWe report on thermal conductivity measurements of aluminum nitride (AlN) films...
Thickness dependency and interfacial structure effects on thermal properties of AlN thin films were ...
International audienceThe effect of the structural inhomogeneity and oxygen defects on the thermal c...
Aluminum nitride (AlN) is one of the few electrically insulating materials with excellent thermal co...
International audienceIn this work, we report the implementation of the ultra-fast transient hot str...
The prediction and measurement of the thermal conductivity, k, of crystalline materials, particularl...
For most micro- and nanoelectronic devices based on thin films applied for effective heat dissipatio...
In order to study thermal conductivities of ta-C and SiC>2 thin films, the PPR system was developed....
High thermal conductivity materials show promise for thermal mitigation and heat removal in devices....
Thermal conductivity of submicron-thick aluminium oxide thin films prepared by middle frequency magn...
In recent years, a lot of efforts have been made in growth of AlN films because of its promising pot...
AlN-Ceramic is very suitable as carrier substrate for multichip modules because of its high thermal ...