The optimal conditions to print the 0.13 mu m line and space are presented for newly constructed x-ray proximity lithography system at Postech Advanced Lithography Center (PALC). The PALC uses the synchrotron light source which is in Pohang Accelerator Laboratory (PAL). The optimal values of the absorber thickness, the bias-width and the spatial blur of the source are investigated with other conditions such as the mask to wafer gap remaining fixed. As a criterion for the optimal aerial image, we introduce hybrid figure of merit(h-FOM) which combines the dose latitude and contrast of the aerial image.X115sciescopu
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer...
A phase shift proximity printing lithographic mask is designed, manufactured and tested. Its design ...
Fabrication of nanoelectronic devices requires a lithography, which realizes besides resolution also...
Image resolution in x-ray proximity printing is influenced by diffraction, photo and Auger electron ...
It is time to revisit X-ray. By enhancing, in the Near Field, Proximity X-ray Lithography (PXL), the...
Includes bibliographical references (p. 155-163).Research supported by Joint Services Electronics Pr...
Image intensity profile and resist profile calculations using the X-ray modeling and simulation prog...
X-ray lithography with wavelengths between 0.2 and 2 nm provides a structural resolution as good as ...
The possibility and usefulness of proximity correction in 100-nm-regime X-ray lithography was examin...
This paper reviews the current state of X-ray lithography (XRL) with special emphasis on the exposur...
By using the near field in proximity x-ray lithography (PXL), a technique is demonstrated that exten...
Photonic crystals and other photonic devices could be efficiently produced using relatively simple a...
Progress on the fabrication of zone plates for hard X-rays is reported. The issue of achieving a hig...
Image intensity profiles and resist profile calculations using the XMAS simulation program are prese...
Soft x-ray radiation is affected neither by scattering in the resist nor by reflection from the subs...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer...
A phase shift proximity printing lithographic mask is designed, manufactured and tested. Its design ...
Fabrication of nanoelectronic devices requires a lithography, which realizes besides resolution also...
Image resolution in x-ray proximity printing is influenced by diffraction, photo and Auger electron ...
It is time to revisit X-ray. By enhancing, in the Near Field, Proximity X-ray Lithography (PXL), the...
Includes bibliographical references (p. 155-163).Research supported by Joint Services Electronics Pr...
Image intensity profile and resist profile calculations using the X-ray modeling and simulation prog...
X-ray lithography with wavelengths between 0.2 and 2 nm provides a structural resolution as good as ...
The possibility and usefulness of proximity correction in 100-nm-regime X-ray lithography was examin...
This paper reviews the current state of X-ray lithography (XRL) with special emphasis on the exposur...
By using the near field in proximity x-ray lithography (PXL), a technique is demonstrated that exten...
Photonic crystals and other photonic devices could be efficiently produced using relatively simple a...
Progress on the fabrication of zone plates for hard X-rays is reported. The issue of achieving a hig...
Image intensity profiles and resist profile calculations using the XMAS simulation program are prese...
Soft x-ray radiation is affected neither by scattering in the resist nor by reflection from the subs...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer...
A phase shift proximity printing lithographic mask is designed, manufactured and tested. Its design ...
Fabrication of nanoelectronic devices requires a lithography, which realizes besides resolution also...