Two copper(I) complexes with organic ligands, [Cu-I(hfac)](2)(DVTMSO) and [Cu-I(hfac)](2)(HD) (hfac=hexafluoroacetylacetonate, DVTMSO=1,2-divinyltetramethyl-disiloxane, HD=1,5-hexadiene), were synthesized and used for copper metallorganic chemical vapor deposition. In these compounds, two Cu(hfac) fragments are bonded by one neutral ligand forming unusual structure with respect to other Cu(I) complexes. The compounds exhibited relatively high volatility and stability when compared to other copper(I) precursors. By using the reported compounds as precursors, a continuous Cu layer was not formed but the Cu islands were only observed. Also, the shape and size of Cu islands are significantly changed as a function of the substrate temperature. (...
[[abstract]]This work demonstrated for the first time low temperature copper (Cu) film deposition by...
The nucleation and successful growth of copper (Cu) thin films on diffusion barrier/adhesion promote...
Copper has become the material of choice for metallization of high-performance ultra-large scale in...
Crystalline copper films were deposited by aerosol-assisted chemical vapor deposition (AACVD) in the...
A nonfluorinated β-diketonate precursor, bis(t- butylacetoacetato)Cu(II) or Cu(tbaoac)2, was sy...
An organometallic precursor, (hexafluoroacetyl-acetonate, hfac)Cu-(1)(vinylcyclohexane, VCH) was stu...
Metal-organic chemical vapor deposition (MOCVD) from the tetrameric precursor copper(I) tert-butoxid...
The effect of the neutral ligand W on the characteristics of hexafluoroacetylacetonate (hfac)Cu(I)-L...
AbstractNew volatile heteroleptic copper(II) complexes having beta-ketoiminate (O,N) and diketonate ...
A direct liquid eoinjeetion system has been applied to the chemical vapor deposition of copper using...
A copper(II) hexafluoroacetylacetonate (1,1,1,5,5,5-hexafluoro-2,4-pentanedionate, hfa) adduct with ...
Copper metal thin films were grown via a CVD process on SiO2/Si substrates using different copper(II...
Abstract: The physico-chemical properties of the beta-diketonate diamine Cu(II) compound with hfa (1...
[[abstract]]This work demonstrated for the first time low temperature copper (Cu) film deposition by...
A dimeric precursor, [Cu(dmae)(OCOCH3)(H2O)]2 for the CVD of copper metal films, (dmaeH = N,N-dimeth...
[[abstract]]This work demonstrated for the first time low temperature copper (Cu) film deposition by...
The nucleation and successful growth of copper (Cu) thin films on diffusion barrier/adhesion promote...
Copper has become the material of choice for metallization of high-performance ultra-large scale in...
Crystalline copper films were deposited by aerosol-assisted chemical vapor deposition (AACVD) in the...
A nonfluorinated β-diketonate precursor, bis(t- butylacetoacetato)Cu(II) or Cu(tbaoac)2, was sy...
An organometallic precursor, (hexafluoroacetyl-acetonate, hfac)Cu-(1)(vinylcyclohexane, VCH) was stu...
Metal-organic chemical vapor deposition (MOCVD) from the tetrameric precursor copper(I) tert-butoxid...
The effect of the neutral ligand W on the characteristics of hexafluoroacetylacetonate (hfac)Cu(I)-L...
AbstractNew volatile heteroleptic copper(II) complexes having beta-ketoiminate (O,N) and diketonate ...
A direct liquid eoinjeetion system has been applied to the chemical vapor deposition of copper using...
A copper(II) hexafluoroacetylacetonate (1,1,1,5,5,5-hexafluoro-2,4-pentanedionate, hfa) adduct with ...
Copper metal thin films were grown via a CVD process on SiO2/Si substrates using different copper(II...
Abstract: The physico-chemical properties of the beta-diketonate diamine Cu(II) compound with hfa (1...
[[abstract]]This work demonstrated for the first time low temperature copper (Cu) film deposition by...
A dimeric precursor, [Cu(dmae)(OCOCH3)(H2O)]2 for the CVD of copper metal films, (dmaeH = N,N-dimeth...
[[abstract]]This work demonstrated for the first time low temperature copper (Cu) film deposition by...
The nucleation and successful growth of copper (Cu) thin films on diffusion barrier/adhesion promote...
Copper has become the material of choice for metallization of high-performance ultra-large scale in...