2016 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2016, Hong Kong, 3-5 August 2016Electrical performance of MOS2 transistor, especially carrier mobility, can be greatly improved by screening the Columbic scattering by a high-k gate dielectric. In this work, Ti is incorporated into HfO2 to form HfTiO dielectric with a higher permittivity, which leads to further enhancement of the screening effect and thus carrier mobility. The effects of annealing ambient (N2, O2 and NH3) on the electrical performance of ALD HfTiO back-gated multilayer M0S2 transistor are investigated, and a highest mobility of 31.1 cm2/(V-s) is achieved for the NH3-annealed sample. However, different from the HfO2 gated MOS2 transistor, ...
Monolayer MoS2 with large area and high quality are grown using chemical vapor deposition (CVD) on S...
HfTiO gate dielectric is first deposited on Si wafer through co-sputtering method. The influences of...
In order to follow the more and more constraining ITRS Roadmap specifications, the microelectronic i...
Atomic layer deposited HfO2 annealed in different ambients (N2, O2, and NH3) is used to replace SiO2...
The electrical performance of MoS2 can be engineered by introducing high-kappa dielectrics, while th...
The electrical performance of MoS2 can be engineered by introducing high-κ dielectrics, while the in...
A new substrate (similar to 30-nm HfO2/Si) is developed for high-performance back-gated molybdenum d...
A new substrate (similar to 30-nm HfO2/Si) is developed for high-performance back-gated molybdenum d...
International audienceField effect transistors (FETs) using two-dimensional molybdenum disulfide (Mo...
Field effect transistors (FETs) using two-dimensional molybdenum disulfide (MoS2) as the channel mat...
[[abstract]]Interaction of HfxTayN metal gate with SiO2 and HfOxNy gate dielectrics has been extensi...
OTFTs with HfTiO 2 as gate dielectric have been successfully fabricated. The devices show small thre...
textFor more than 40 years, MOS device technologies have been improving at a dramatic rate. These t...
textAggressive scaling of CMOS integrated circuits requires continuous miniaturization of the MOS t...
textAggressive scaling of CMOS integrated circuits requires continuous miniaturization of the MOS t...
Monolayer MoS2 with large area and high quality are grown using chemical vapor deposition (CVD) on S...
HfTiO gate dielectric is first deposited on Si wafer through co-sputtering method. The influences of...
In order to follow the more and more constraining ITRS Roadmap specifications, the microelectronic i...
Atomic layer deposited HfO2 annealed in different ambients (N2, O2, and NH3) is used to replace SiO2...
The electrical performance of MoS2 can be engineered by introducing high-kappa dielectrics, while th...
The electrical performance of MoS2 can be engineered by introducing high-κ dielectrics, while the in...
A new substrate (similar to 30-nm HfO2/Si) is developed for high-performance back-gated molybdenum d...
A new substrate (similar to 30-nm HfO2/Si) is developed for high-performance back-gated molybdenum d...
International audienceField effect transistors (FETs) using two-dimensional molybdenum disulfide (Mo...
Field effect transistors (FETs) using two-dimensional molybdenum disulfide (MoS2) as the channel mat...
[[abstract]]Interaction of HfxTayN metal gate with SiO2 and HfOxNy gate dielectrics has been extensi...
OTFTs with HfTiO 2 as gate dielectric have been successfully fabricated. The devices show small thre...
textFor more than 40 years, MOS device technologies have been improving at a dramatic rate. These t...
textAggressive scaling of CMOS integrated circuits requires continuous miniaturization of the MOS t...
textAggressive scaling of CMOS integrated circuits requires continuous miniaturization of the MOS t...
Monolayer MoS2 with large area and high quality are grown using chemical vapor deposition (CVD) on S...
HfTiO gate dielectric is first deposited on Si wafer through co-sputtering method. The influences of...
In order to follow the more and more constraining ITRS Roadmap specifications, the microelectronic i...