Micro-grinding of Reaction-Bonded SiC/Si composites (RB-SiC/Si) were conducted to investigate the surface generation mechanism. The results showed that amorphization occurred for both SiC and Si phases, and C segregation appeared on SiC surface and at the interface of SiC and Si. The surface generation mechanism changed from micro-breaking to smoother surface, but accompanied by formation of many micro-pits at phase boundaries with the decrease of feed rate. It was identified that the material removal mode was closely related to amorphization and C segregation (i.e. amorphization would promote ductile material removal while C segregation would aggravate surface fracture and increase the number of micro-pits). Furthermore, it was found that ...
The precision and crack-free surface of brittle silicon carbide (SiC) ceramic was achieved in the na...
Single-point diamond scratching and nanoindentation on monocrystalline silicon wafer were performed ...
Cubic silicon carbide (SiC) is an extremely hard and brittle material having unique blend of materia...
The surface generation mechanisms of WC/Co and Reaction-bonded SiC/Si (RB-SiC/Si) composites under h...
PolyU Library Call No.: [THS] LG51 .H577P ISE 2016 Zhangxxiii, 210 pages :color illustrationsTo ensu...
Single crystal silicon carbide is widely used for microelectronics, optoelectronics and medicine sec...
Surface and subsurface damages appear inevitably in the grinding process, which will influence the p...
Surface and subsurface damages appear inevitably in the grinding process, which will influence the p...
A study of the wear mechanism on a reaction bonded silicon carbide (RB-SiC) subjected to fixed abras...
Surface and subsurface damages appear inevitably in the grinding process, which will influence the p...
The magnetic fluid-assisted polishing for fuse silica and other optical materials with a high degree...
Recent development of device fabrication of SiC is awaiting detailed study of the machining of the s...
Microcracks inevitably appear on the SiC wafer surface during conventional thinning. It is generally...
Surface characterization of 6H-SiC (0001) substrates in indentation and abrasive machining was carri...
Abstract. Spherical grinding was conducted with a ductile regime mode using a CNC grinding machine a...
The precision and crack-free surface of brittle silicon carbide (SiC) ceramic was achieved in the na...
Single-point diamond scratching and nanoindentation on monocrystalline silicon wafer were performed ...
Cubic silicon carbide (SiC) is an extremely hard and brittle material having unique blend of materia...
The surface generation mechanisms of WC/Co and Reaction-bonded SiC/Si (RB-SiC/Si) composites under h...
PolyU Library Call No.: [THS] LG51 .H577P ISE 2016 Zhangxxiii, 210 pages :color illustrationsTo ensu...
Single crystal silicon carbide is widely used for microelectronics, optoelectronics and medicine sec...
Surface and subsurface damages appear inevitably in the grinding process, which will influence the p...
Surface and subsurface damages appear inevitably in the grinding process, which will influence the p...
A study of the wear mechanism on a reaction bonded silicon carbide (RB-SiC) subjected to fixed abras...
Surface and subsurface damages appear inevitably in the grinding process, which will influence the p...
The magnetic fluid-assisted polishing for fuse silica and other optical materials with a high degree...
Recent development of device fabrication of SiC is awaiting detailed study of the machining of the s...
Microcracks inevitably appear on the SiC wafer surface during conventional thinning. It is generally...
Surface characterization of 6H-SiC (0001) substrates in indentation and abrasive machining was carri...
Abstract. Spherical grinding was conducted with a ductile regime mode using a CNC grinding machine a...
The precision and crack-free surface of brittle silicon carbide (SiC) ceramic was achieved in the na...
Single-point diamond scratching and nanoindentation on monocrystalline silicon wafer were performed ...
Cubic silicon carbide (SiC) is an extremely hard and brittle material having unique blend of materia...