International Conference on Materials for Advanced Technologies, ICMAT2011 - Symposium G: NEMS/MEMS and MicroTAS, Suntec, 26 June-1 July 2011With high piezoelectric coefficient (d33> 300 pC/N) and electromechanical coupling factor (kI = 0.45), lead-free barium strontium zirconium titanate ((Ba0.95Sr0.05) (Zr 0.05Ti0.95) O3, abbreviated as BSZT)was used to fabricate BSZT/epoxy 1-3 composites with different volume fractions of BSZT ranging from 0.55 - 0.85. The electromechanical properties of the 1-3 composites were determined by the resonance technique. It was found that the theoretical modeling of the 1-3 composites matches quite well with the measured material properties.The 1-3 composite with φ = 0.65 was chosen to be fabricated as a t...
xxiii, 271 leaves : ill. (some col.) ; 30 cm.PolyU Library Call No.: [THS] LG51 .H577P AP 2001 OrStu...
The electroacoustic performance of 1-3 piezoelectric composite transducers with low loss polymer fil...
Piezocomposite ultasonic transducers for high-frequency microelectronics wire bonding have been deve...
With high piezoelectric coefficient (d33> 300 pC/N) and electromechanical coupling factor (kt = 0...
A lead-free piezoelectric ceramic, 0.94(Bi0.5Na0.5) TiO3-0.06BaTiO3 (BNBT-6), was used to fabricate ...
A lead-free piezoelectric ceramic, 0.94(Bi0.5Na0.5) TiO3–0.06BaTiO3 (BNBT-6), was used to fabricate ...
This paper describes the fabrication and evaluation of a high-frequency (40 MHz) transducer based on...
xix, 121 leaves : ill. ; 30 cm.PolyU Library Call No.: [THS] LG51 .H577M AP 2012 LeeThe main objecti...
Barium-modified bismuth sodium titanate, 0.94 ×(Bi 0.5Na0.5)TiO3-0.06BaTiO3 (BNBT-6), fine-scale pie...
2014-2015 > Academic research: refereed > Publication in refereed journalVersion of RecordPublishe
Mn-doped 0.7BiFeO3-0.3BaTiO3 (BFO-0.3BTO+Mn 1% mol) lead-free piezoelectric ceramic were fabricated ...
Mn-doped 0.7BiFeO3-0.3BaTiO3 (BFO-0.3BTO+Mn 1% mol) lead-free piezoelectric ceramic were fabricated ...
[[abstract]]Piezocomposites with 1-3 connectivity have been extensively used in medical imaging tran...
1-3 composites consist of ceramic rods embedded in a polymeric matrix. They have attracted considera...
[[abstract]]Piezocomposites with 1-3 connectivity have been extensively used in medical imaging tran...
xxiii, 271 leaves : ill. (some col.) ; 30 cm.PolyU Library Call No.: [THS] LG51 .H577P AP 2001 OrStu...
The electroacoustic performance of 1-3 piezoelectric composite transducers with low loss polymer fil...
Piezocomposite ultasonic transducers for high-frequency microelectronics wire bonding have been deve...
With high piezoelectric coefficient (d33> 300 pC/N) and electromechanical coupling factor (kt = 0...
A lead-free piezoelectric ceramic, 0.94(Bi0.5Na0.5) TiO3-0.06BaTiO3 (BNBT-6), was used to fabricate ...
A lead-free piezoelectric ceramic, 0.94(Bi0.5Na0.5) TiO3–0.06BaTiO3 (BNBT-6), was used to fabricate ...
This paper describes the fabrication and evaluation of a high-frequency (40 MHz) transducer based on...
xix, 121 leaves : ill. ; 30 cm.PolyU Library Call No.: [THS] LG51 .H577M AP 2012 LeeThe main objecti...
Barium-modified bismuth sodium titanate, 0.94 ×(Bi 0.5Na0.5)TiO3-0.06BaTiO3 (BNBT-6), fine-scale pie...
2014-2015 > Academic research: refereed > Publication in refereed journalVersion of RecordPublishe
Mn-doped 0.7BiFeO3-0.3BaTiO3 (BFO-0.3BTO+Mn 1% mol) lead-free piezoelectric ceramic were fabricated ...
Mn-doped 0.7BiFeO3-0.3BaTiO3 (BFO-0.3BTO+Mn 1% mol) lead-free piezoelectric ceramic were fabricated ...
[[abstract]]Piezocomposites with 1-3 connectivity have been extensively used in medical imaging tran...
1-3 composites consist of ceramic rods embedded in a polymeric matrix. They have attracted considera...
[[abstract]]Piezocomposites with 1-3 connectivity have been extensively used in medical imaging tran...
xxiii, 271 leaves : ill. (some col.) ; 30 cm.PolyU Library Call No.: [THS] LG51 .H577P AP 2001 OrStu...
The electroacoustic performance of 1-3 piezoelectric composite transducers with low loss polymer fil...
Piezocomposite ultasonic transducers for high-frequency microelectronics wire bonding have been deve...