The way printed circuit board interconnects for high-speed digital signals are designed ultimately determines the performance that can be achieved for a certain interface, thus having a profound impact on whether the complete communication channel will comply with the desired standard specification or not. Good understanding and methods for anticipating and verifying this behaviour through computer simulations and practical measurements are therefore essential. Characterization of an interconnect can be performed either in the time domain or in the frequency domain. Regardless of the domain chosen, a method for unobstrusively connecting to the test object is required. After various different attempts it could be concluded that frequency dom...
In this paper, we introduce the microwave transmission characteristics of interconnection lines on a...
Interconnect lines are characterized in the wafer-level for high-speed circuit performance evaluatio...
This paper presents the frequency domain characterization of very high bandwidth connectorized trace...
As chip complexity and speed continue to increase, the packaging interconnects increasingly affect t...
The development of modern digital communication systems has been entered a new era with faster signa...
Graduation date: 1995With edge rates of high speed digital devices pushing into the sub-nano second\...
In this paper we examine different approaches to the extraction of frequency dependent line paramete...
The era of the internet-of-things (IOT) is expanding the utilization of mobile and cloud computing t...
This paper presents an enlarged study about the 50-% propagation-time assessment of cascaded transmi...
"Signal Integrity Characterization Techniques" addresses the gap between traditional digital and mic...
At present, the performance of most high speed digital systems is not limited by the speed of the sw...
ABSTRACT Beyond GHz operation frequency and Gb/s transfer rate bring a big challenge to high speed p...
Thesis (Ph. D.)--University of Washington, 1997As clock speeds of digital circuits continue to incre...
A via is experimentally characterized by using high-frequency s-parameter measurements. Test patter...
Interconnect lines with inter-layer vias are experimentally characterized by using high-frequency S-...
In this paper, we introduce the microwave transmission characteristics of interconnection lines on a...
Interconnect lines are characterized in the wafer-level for high-speed circuit performance evaluatio...
This paper presents the frequency domain characterization of very high bandwidth connectorized trace...
As chip complexity and speed continue to increase, the packaging interconnects increasingly affect t...
The development of modern digital communication systems has been entered a new era with faster signa...
Graduation date: 1995With edge rates of high speed digital devices pushing into the sub-nano second\...
In this paper we examine different approaches to the extraction of frequency dependent line paramete...
The era of the internet-of-things (IOT) is expanding the utilization of mobile and cloud computing t...
This paper presents an enlarged study about the 50-% propagation-time assessment of cascaded transmi...
"Signal Integrity Characterization Techniques" addresses the gap between traditional digital and mic...
At present, the performance of most high speed digital systems is not limited by the speed of the sw...
ABSTRACT Beyond GHz operation frequency and Gb/s transfer rate bring a big challenge to high speed p...
Thesis (Ph. D.)--University of Washington, 1997As clock speeds of digital circuits continue to incre...
A via is experimentally characterized by using high-frequency s-parameter measurements. Test patter...
Interconnect lines with inter-layer vias are experimentally characterized by using high-frequency S-...
In this paper, we introduce the microwave transmission characteristics of interconnection lines on a...
Interconnect lines are characterized in the wafer-level for high-speed circuit performance evaluatio...
This paper presents the frequency domain characterization of very high bandwidth connectorized trace...