The fundamental mechanisms behind the generation of compressive stresses in polycrystalline thin films, the effects of pulsed deposition fluxes on the dynamics of the early growth stages as well as the generation of energetic Ar+ ions in high power impulse magnetron sputtering (HiPIMS) discharges has been studied in this thesis. It was found that compressive film stresses in Mo films deposited using energetic vapor fluxes are correlated with high film densities while only a slight lattice expansion compared to relaxed Mo was found. This implies that the stress is caused by grain boundary densification and not defect creation in the grain bulk. The compressive stress magnitude should scale with the grain boundary length per unit area, or the...
International audienceThe stress evolution of IBS-deposited Mo and Si 100-nm-thick films has been in...
Restricted until 03 Nov. 2012.The correlation between external (e.g. power, pressure) and internal (...
We studied the tensile stress and grain-width evolution in sputter-deposited Cr films with thickness...
International audienceIntrinsic stresses in vapor deposited thin films have been a topic of consider...
International audienceIntrinsic stresses in vapor deposited thin films have been a topic of consider...
We present evidence for compressive stress generation via atom insertion into grain boundaries in po...
The present work is focused on understanding the underlying mechanisms for stress generation and rel...
The present work is focused on understanding the underlying mechanisms for stress generation and rel...
Pulsed, ionized vapour fluxes, generated from high power impulse magnetron sputtering (HiPIMS) disch...
Pulsed, ionized vapour fluxes, generated from high power impulse magnetron sputtering (HiPIMS) disch...
International audienceThis study reports on the control of intrinsic stress in MoCr films deposited ...
In the absence of thermal stress, tensile stress in hard metal films is caused by grain boundary shr...
CNPQ - CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICOIon bombardment during film grow...
In the absence of thermal stress, tensile stress in hard metal films is caused by grain boundary shr...
Energetic-ion bombardment has become an attractive route to modify the crystal growth and deposit hi...
International audienceThe stress evolution of IBS-deposited Mo and Si 100-nm-thick films has been in...
Restricted until 03 Nov. 2012.The correlation between external (e.g. power, pressure) and internal (...
We studied the tensile stress and grain-width evolution in sputter-deposited Cr films with thickness...
International audienceIntrinsic stresses in vapor deposited thin films have been a topic of consider...
International audienceIntrinsic stresses in vapor deposited thin films have been a topic of consider...
We present evidence for compressive stress generation via atom insertion into grain boundaries in po...
The present work is focused on understanding the underlying mechanisms for stress generation and rel...
The present work is focused on understanding the underlying mechanisms for stress generation and rel...
Pulsed, ionized vapour fluxes, generated from high power impulse magnetron sputtering (HiPIMS) disch...
Pulsed, ionized vapour fluxes, generated from high power impulse magnetron sputtering (HiPIMS) disch...
International audienceThis study reports on the control of intrinsic stress in MoCr films deposited ...
In the absence of thermal stress, tensile stress in hard metal films is caused by grain boundary shr...
CNPQ - CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICOIon bombardment during film grow...
In the absence of thermal stress, tensile stress in hard metal films is caused by grain boundary shr...
Energetic-ion bombardment has become an attractive route to modify the crystal growth and deposit hi...
International audienceThe stress evolution of IBS-deposited Mo and Si 100-nm-thick films has been in...
Restricted until 03 Nov. 2012.The correlation between external (e.g. power, pressure) and internal (...
We studied the tensile stress and grain-width evolution in sputter-deposited Cr films with thickness...